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Erschienen in:
2006 | OriginalPaper | Buchkapitel
Three-Dimensional Stress Intensity Factors Analyses of Interface Cracks Between Dissimilar Anisotropic Materials
verfasst von : Masaki Nagai, Toru Ikeda, Noriyuki Miyazaki
Erschienen in: Fracture of Nano and Engineering Materials and Structures
Verlag: Springer Netherlands
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The down sizing of electronic devices, the incredible progress of micro-electro-mechanical system (MEMS) and the development of composites materials demand the effective technique to evaluate the reliability of interfaces between dissimilar materials. The main cause of interface fracture is thermal stress due to the difference of thermal expansion of jointed materials. Many of these materials are anisotropic materials like composite materials, single crystals and so on.