Two-dimensional analysis of progressive delamination in thin film electrodes

By employing the two-dimensional analysis, i.e., plane strain and plane stress, a semi-analytical method is developed to investigate the interfacial delamination in electrodes. The key parameters are obtained from the governing equations, and their effects on the evolution of the delamination are evaluated. The impact of constraint perpendicular to the plane is also investigated by comparing the plane strain and plane stress. It is found that the delamination in the plane strain condition occurs easier, indicating that the constraint is harmful to maintain the structure stability. According to the obtained governing equations, a formula of the dimensionless critical size for delamination is provided, which is a function of the maximum volumetric strain and the Poisson’s ratio of the active layer.