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Erschienen in:

05.06.2023

Ultra-thin double barrier AlGaN/GaN high threshold voltage HEMT with graded AlGaN/Si3N4 gate and p-type buffer layer

verfasst von: Kexiu Dong, Yangyi Zhang, Bingting Wang, Yanli liu, Wenjuan Yu

Erschienen in: Journal of Computational Electronics | Ausgabe 4/2023

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Abstract

An ultra-thin double barrier enhancement mode (E-mode) AlGaN/GaN high-electron mobility transistor (HEMT) with p-type buffer layer and Si3N4/graded p-AlGaN gate is proposed and investigated by Silvaco TCAD. The simulation results show that the designed HEMT can obtain a high threshold voltage over 5.0 V and large gate swing. The maximum gate leakage current is 3.11 × 10–4 A/mm at 30 V gate voltage, which decreases four orders of magnitude compared to the conventional double barrier HEMTs. Due to the p-type buffer layer, the cut-off frequency for the proposed HEMT is raised over three-times compared to the conventional double barrier structure HEMT with n-type buffer layer. Meanwhile the designed HEMT exhibits high breakdown voltage and large current-gain. Moreover, the impacts of Si3N4 layer thickness under gate and GaN channel layer thickness are analyzed. Both layers play significant roles in obtaining high threshold voltage for the device by adjusting the conduction band energy of AlGaN/GaN interface potential well.

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Metadaten
Titel
Ultra-thin double barrier AlGaN/GaN high threshold voltage HEMT with graded AlGaN/Si3N4 gate and p-type buffer layer
verfasst von
Kexiu Dong
Yangyi Zhang
Bingting Wang
Yanli liu
Wenjuan Yu
Publikationsdatum
05.06.2023
Verlag
Springer US
Erschienen in
Journal of Computational Electronics / Ausgabe 4/2023
Print ISSN: 1569-8025
Elektronische ISSN: 1572-8137
DOI
https://doi.org/10.1007/s10825-023-02063-3