Skip to main content
main-content

Über dieses Buch

This book contains extended and revised versions of the best papers presented at the 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, held in Santa Cruz, CA, USA, in October 2012. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.

Inhaltsverzeichnis

Frontmatter

2013 | OriginalPaper | Buchkapitel

FPGA-Based High-Speed Authenticated Encryption System

Michael Muehlberghuber, Christoph Keller, Frank K. Gürkaynak, Norbert Felber

2013 | OriginalPaper | Buchkapitel

A Smart Memory Accelerated Computed Tomography Parallel Backprojection

Qiuling Zhu, Larry Pileggi, Franz Franchettis

2013 | OriginalPaper | Buchkapitel

Trinocular Stereo Vision Using a Multi Level Hierarchical Classification Structure

Andy Motten, Luc Claesen, Yun Pan

2013 | OriginalPaper | Buchkapitel

Spatially-Varying Image Warping: Evaluations and VLSI Implementations

Pierre Greisen, Michael Schaffner, Danny Luu, Val Mikos, Simon Heinzle, Frank K. Gürkaynak, Aljoscha Smolic

2013 | OriginalPaper | Buchkapitel

An Ultra-Low-Power Application-Specific Processor with Sub-VT Memories for Compressed Sensing

Jeremy Constantin, Ahmed Dogan, Oskar Andersson, Pascal Meinerzhagen, Joachim Rodrigues, David Atienza, Andreas Burg

2013 | OriginalPaper | Buchkapitel

Configurable Low-Latency Interconnect for Multi-core Clusters

Giulia Beanato, Igor Loi, Giovanni De Micheli, Yusuf Leblebici, Luca Benini

2013 | OriginalPaper | Buchkapitel

A Hexagonal Processor and Interconnect Topology for Many-Core Architecture with Dense On-Chip Networks

Zhibin Xiao, Bevan Baas

2013 | OriginalPaper | Buchkapitel

Fault-Tolerant Techniques to Manage Yield and Power Constraints in Network-on-Chip Interconnections

Anelise Kologeski, Caroline Concatto, Fernanda Lima Kastensmidt, Luigi Carro

2013 | OriginalPaper | Buchkapitel

On the Automatic Generation of Software-Based Self-Test Programs for Functional Test and Diagnosis of VLIW Processors

Davide Sabena, Luca Sterpone, Matteo Sonza Reorda

2013 | OriginalPaper | Buchkapitel

SEU-Aware Low-Power Memories Using a Multiple Supply Voltage Array Architecture

Seokjoong Kim, Matthew R. Guthaus

2013 | OriginalPaper | Buchkapitel

CMOS Implementation of Threshold Gates with Hysteresis

Farhad A. Parsan, Scott C. Smith

2013 | OriginalPaper | Buchkapitel

Simulation and Experimental Characterization of a Unified Memory Device with Two Floating-Gates

Neil Di Spigna, Daniel Schinke, Srikant Jayanti, Veena Misra, Paul Franzon

Backmatter

Weitere Informationen

Premium Partner

Neuer Inhalt

BranchenIndex Online

Die B2B-Firmensuche für Industrie und Wirtschaft: Kostenfrei in Firmenprofilen nach Lieferanten, Herstellern, Dienstleistern und Händlern recherchieren.

Whitepaper

- ANZEIGE -

Product Lifecycle Management im Konzernumfeld – Herausforderungen, Lösungsansätze und Handlungsempfehlungen

Für produzierende Unternehmen hat sich Product Lifecycle Management in den letzten Jahrzehnten in wachsendem Maße zu einem strategisch wichtigen Ansatz entwickelt. Forciert durch steigende Effektivitäts- und Effizienzanforderungen stellen viele Unternehmen ihre Product Lifecycle Management-Prozesse und -Informationssysteme auf den Prüfstand. Der vorliegende Beitrag beschreibt entlang eines etablierten Analyseframeworks Herausforderungen und Lösungsansätze im Product Lifecycle Management im Konzernumfeld.
Jetzt gratis downloaden!

Bildnachweise