skip to main content
10.1145/1614320.1614345acmconferencesArticle/Chapter ViewAbstractPublication PagesmobicomConference Proceedingsconference-collections
research-article

A scalable micro wireless interconnect structure for CMPs

Published:20 September 2009Publication History

ABSTRACT

This paper describes an unconventional way to apply wireless networking in emerging technologies. It makes the case for using a two-tier hybrid wireless/wired architecture to interconnect hundreds to thousands of cores in chip multiprocessors (CMPs), where current interconnect technologies face severe scaling limitations in excessive latency, long wiring, and complex layout. We propose a recursive wireless interconnect structure called the WCube that features a single transmit antenna and multiple receive antennas at each micro wireless router and offers scalable performance in terms of latency and connectivity. We show the feasibility to build miniature on-chip antennas, and simple transmitters and receivers that operate at 100-500 GHz sub-terahertz frequency bands. We also devise new two-tier wormhole based routing algorithms that are deadlock free and ensure a minimum-latency route on a 1000-core on-chip interconnect network. Our simulations show that our protocol suite can reduce the observed latency by 20% to 45%, and consumes power that is comparable to or less than current 2-D wired mesh designs.

References

  1. V. Agarwal, M. S. Hrishikesh, S. W. Keckler, and D. Burger. Clock rate versus IPC: the end of the road for conventional microarchitecture. ISCA-27, 2000. Google ScholarGoogle ScholarDigital LibraryDigital Library
  2. J. Andrews and N. Backer. Xbox360 system architecture. Hot Chips, 2005.Google ScholarGoogle Scholar
  3. Ansoft Corporation. High Frequency Structure Simulator (HFSS). http://www.ansoft.com/products/hf/hfss/Google ScholarGoogle Scholar
  4. K. Asanovic et al. The landscape of parallel computing research: a view from Berkeley. Technical Report, UCB/EECS-2006-183.Google ScholarGoogle Scholar
  5. S. Borkar. Thousand core chips: a technology perspective. DAC, 2007. Google ScholarGoogle ScholarDigital LibraryDigital Library
  6. L. A. Barroso et al. Piranha: a scalable architecture based on single-chipmultiprocessing. ISCA-27, 2000. Google ScholarGoogle ScholarDigital LibraryDigital Library
  7. M.-C. F. Chang et al. CMP network-on-chip overlaid with multi-band RF-Interconnect. HPCA, 2008.Google ScholarGoogle Scholar
  8. M.-C. F. Chang et al. Power reduction of CMP communication networks via RF-Interconnects. MICRO, 2008. Google ScholarGoogle ScholarDigital LibraryDigital Library
  9. D. Choudhury, J. Foschaar, R. Bowen, M. Mokhtari. A 70 GHz BW package for multigigabit IC applications. Microwave Symposium Digest, June 2004.Google ScholarGoogle ScholarCross RefCross Ref
  10. S. Boyd-Wickizer et al. Corey: an operating system for many cores. OSDI, 2006. Google ScholarGoogle ScholarDigital LibraryDigital Library
  11. W. Dally and C. Seitz. Deadlock-free message routing in multiprocessor interconnection networks. IEEE Trans. on Computers, 1987. Google ScholarGoogle ScholarDigital LibraryDigital Library
  12. W. Dally. Virtual-channel flow control. IEEE Trans. on Parallel and Distributed Systems, 1992. Google ScholarGoogle ScholarDigital LibraryDigital Library
  13. W. Dally. Wire efficient VLSI multiprocessor communication networks. Proc. Stanford Conf. Advanced Research VLSI, 1987.Google ScholarGoogle Scholar
  14. D. Huang et al. Terahertz CMOS frequency generator using linear superposition technique. IEEE Journal of Solid State Circuits, Dec 2008.Google ScholarGoogle ScholarCross RefCross Ref
  15. A. Duller, G. Panesar, and D. Towner. Parallel Processing - the picoChip way!. Communicating Process Architectures, 2003.Google ScholarGoogle Scholar
  16. B. A. Floyd. Intra-chip wireless interconnect for clock distribution implemented with integrated antennas, receivers, and transmitters. IEEE JSSC, 2002.Google ScholarGoogle ScholarCross RefCross Ref
  17. N. Agarwal et al. Garnet: A detailed interconnection network model inside a full-system simulation framework. TR CE-P08-001, Princeton University, 2007.Google ScholarGoogle Scholar
  18. C. J. Glass, L. M. Ni. The turn model for adaptive routing. ISCA-19, 1992. Google ScholarGoogle ScholarDigital LibraryDigital Library
  19. A. Ghuloum, Unwelcome advice from Intel.blogs.intel.com/research/2008/06/unwelcome_advice.Google ScholarGoogle Scholar
  20. B. Grot and S. W. Keckler. Scalable on-chip interconnect topologies. 2nd Workshop on Chip Multiprocessor Memory Systems and Interconnects, 2008.Google ScholarGoogle Scholar
  21. International technology roadmap for semiconductors, 2007 edition.http://www.itrs.net/Links/2007ITRS/2007_Chapter/2007_Wireless.pdfGoogle ScholarGoogle Scholar
  22. D. N. Jayasimha, B. Zafar, Y. Hoskote. On-chip interconnection networks: why they are different and how to compare them. Technical Report, Intel Corp, 2006Google ScholarGoogle Scholar
  23. J. Kahle, M. Day, H. Hofstee, C. Johns, T. Maeurer and D. Shippy. Introduction to the Cell multiprocessor. IBM Journal of Research and Development, 2005. Google ScholarGoogle ScholarDigital LibraryDigital Library
  24. J. Kim, J. Balfour, and W. Dally. Flattened butterfly topology for on-chip networks. MICRO, 2007. Google ScholarGoogle ScholarDigital LibraryDigital Library
  25. G. Koch. Intel's road to multi-core chip architecture.www.intel.com/cd/00/00/22/09/220997_220997.pdfGoogle ScholarGoogle Scholar
  26. NVIDIA Quadro FX 5600. http://www.nvidia.com/docs/IO/40049/quadro_fx_5600_datasheet.pdfGoogle ScholarGoogle Scholar
  27. NVIDIA Tesla C1060. http://www.nvidia.com/docs/IO/56483/Tesla_C1060_boardSpec_v03.pdfGoogle ScholarGoogle Scholar
  28. K. Olukotun and L. Hammond. The future of microprocessors. ACM QUEUE Magazine, September 2005. Google ScholarGoogle ScholarDigital LibraryDigital Library
  29. K. Olukotun, L. Hammond, and J. Laudon. Chip multiprocessor architecture: techniques to improve throughput and latency. Morgan&Claypool, 2007. Google ScholarGoogle ScholarDigital LibraryDigital Library
  30. S.-W. Tam et al. A simultaneous tri-band on-chip RF-Interconnect for future network-on-chip. VLSI Symposium, 2009.Google ScholarGoogle Scholar
  31. E. Seok et al. A 410GHz CMOS push-push oscillator with an on-chip patch antenna. ISSCC, 2008.Google ScholarGoogle ScholarCross RefCross Ref
  32. S. Vangal et al. An 80-tile 1.28 TFLOPS network-on-chip in 65nm CMOS. IEEE ISSCC, 2007.Google ScholarGoogle Scholar
  33. H. -S. Wang et al. Orion: a power-performance simulator for interconnection networks. Int' Symposium on Microarchitecture, 2002. Google ScholarGoogle ScholarDigital LibraryDigital Library
  34. D. Zhao and Y. Wang.SD-MAC: design and synthesis of a hardware-efficient collition-free QoS-aware MAC protocolfor wireless network-on-chip. IEEE Transactions on Computers, Vol.57, No.9, September 2008. Google ScholarGoogle ScholarDigital LibraryDigital Library

Index Terms

  1. A scalable micro wireless interconnect structure for CMPs

        Recommendations

        Comments

        Login options

        Check if you have access through your login credentials or your institution to get full access on this article.

        Sign in
        • Published in

          cover image ACM Conferences
          MobiCom '09: Proceedings of the 15th annual international conference on Mobile computing and networking
          September 2009
          368 pages
          ISBN:9781605587028
          DOI:10.1145/1614320

          Copyright © 2009 ACM

          Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

          Publisher

          Association for Computing Machinery

          New York, NY, United States

          Publication History

          • Published: 20 September 2009

          Permissions

          Request permissions about this article.

          Request Permissions

          Check for updates

          Qualifiers

          • research-article

          Acceptance Rates

          Overall Acceptance Rate440of2,972submissions,15%

        PDF Format

        View or Download as a PDF file.

        PDF

        eReader

        View online with eReader.

        eReader