Elena Kakoulli
ABSTRACT
On-chip electrical links exhibit large energy-to-bandwidth costs, whereas on-chip nanophotonics, which attain high throughput, yet energy-efficient communication, have emerged as an alternative interconnect in multicore chips. Here we consider silicon nanophotonic components that are embedded completely within the silica (SiO2) substrate as opposed to existing die on-surface silicon nanophotonics. As nanophotonic components now reside subsurface, within the silica substrate, non-obstructive interconnect geometries offering higher network throughput can be implemented. First, we show using detailed simulations based on commercial tools that such Silicon-in-Silica (SiS) structures are feasible, and then demonstrate our proof of concept by utilizing a SiS-based mesh-interconnected topology with augmented diagonal optical channels that provides both higher effective throughput and throughput-to-power ratio versus prior-art.
- C. Li et al. LumiNOC: A Power-Efficient, High-Performance, Photonic Network-on-Chip. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 33, No. 6, pp. 826--838, June 2014.Google Scholar
Cross Ref
- D. Vantrease et al. Corona: System Implications of Emerging Nanophotonic Technology. Proc. 35th ACM/IEEE International Symposium on Computer Architecture, pp. 153--164, June 2008. Google ScholarDigital Library
- RSoft Optical Software Solutions, Synopsys Inc. Available {online} http://optics.synopsys.com/rsoft/, 2014.Google Scholar
- T. P. White et al. Silica-Embedded Silicon Photonic Crystal Waveguides. Optics Express, Vol. 16, No. 21, pp. 17076--17081, Oct. 2008.Google Scholar
- A. B. Kahng et al. ORION 2.0: A Power-Area Simulator For Interconnection Networks. IEEE Transactions on Very Large Scale Integration Systems, Vol. 20, No. 1, pp. 191--196, 2011. Google ScholarDigital Library
Index Terms
- Designing High-Performance, Power-Efficient NoCs With Embedded Silicon-in-Silica Nanophotonics
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