Finite element analysis and simulation of adhesive bonding, soldering and brazing—an addendum: a bibliography (1996–2002)

This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis and simulation of adhesive bonding, soldering and brazing. The bibliography is an addendum to the Finite element analysis and simulation of adhesive bonding, soldering and brazing: a bibliography (1976–96) published in the 1997 Modelling Simul. Mater. Sci. Eng. 5 159–85. The added bibliography at the end of this article contains 867 references to papers and conference proceedings on the subject that were published in 1996–2002. The following topics are included: adhesive bonding—stress analysis of adhesive bonding in general, stress analysis and design of specific bonded joints, fracture mechanics and fatigue analysis, destructive and non-destructive evaluation of bonds, and other topics; soldering—thermal stresses and deformation analysis of solder joints, fracture mechanics aspects and fatigue analysis of solder joints, solder joint reliability; and brazing—finite element analysis and simulations.