Thermoelectric figure of merit of (In0.53Ga0.47As)0.8(In0.52Al0.48As)0.2 III-V semiconductor alloys

Je-Hyeong Bahk, Zhixi Bian, Mona Zebarjadi, Joshua M. O. Zide, Hong Lu, Dongyan Xu, Joseph P. Feser, Gehong Zeng, Arun Majumdar, Arthur C. Gossard, Ali Shakouri, and John E. Bowers
Phys. Rev. B 81, 235209 – Published 10 June 2010

Abstract

The thermoelectric figure of merit is measured and theoretically analyzed for n-type Si-doped InGaAlAs III-V quaternary alloys at high temperatures. The Seebeck coefficient, electrical conductivity, and thermal conductivity of a Si-doped (In0.53Ga0.47As)0.8(In0.52Al0.48As)0.2 of 2μm thickness lattice matched to InP substrate grown by molecular-beam epitaxy are measured up to 800 K. The measurement results are analyzed using the Boltzmann transport theory based on the relaxation-time approximation and the theoretical calculation is extended to find optimal carrier densities that maximize the figure of merit at various temperatures. The figure of merit of 0.9 at 800 K is measured at a doping level of 1.9×1018cm3 and the theoretical prediction shows that the figure of merit can reach 1.3 at 1000 K at a doping level of 1.5×1018cm3.

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  • Received 9 February 2010

DOI:https://doi.org/10.1103/PhysRevB.81.235209

©2010 American Physical Society

Authors & Affiliations

Je-Hyeong Bahk1, Zhixi Bian2, Mona Zebarjadi2, Joshua M. O. Zide3, Hong Lu1,4, Dongyan Xu5, Joseph P. Feser5, Gehong Zeng1, Arun Majumdar5, Arthur C. Gossard4, Ali Shakouri2, and John E. Bowers1

  • 1Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA
  • 2Electrical Engineering Department, University of California, Santa Cruz, California 95064, USA
  • 3Materials Science and Engineering Department, University of Delaware, Newark, Delaware 19716, USA
  • 4Materials Department, University of California, Santa Barbara, California 93106, USA
  • 5Department of Mechanical Engineering, University of California, Berkeley, California 94720, USA

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Issue

Vol. 81, Iss. 23 — 15 June 2010

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