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TEI '17: Proceedings of the Eleventh International Conference on Tangible, Embedded, and Embodied Interaction
ACM2017 Proceeding
Publisher:
  • Association for Computing Machinery
  • New York
  • NY
  • United States
Conference:
TEI '17: Eleventh International Conference on Tangible, Embedded, and Embodied Interaction Yokohama Japan March 20 - 23, 2017
ISBN:
978-1-4503-4676-4
Published:
20 March 2017
Sponsors:

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Abstract

Welcome to ACM TEI'17, the 11th-anniversary edition of the International Conference on Tangible, Embedded and Embodied Interactions, hosted at Keio University Graduate School of Media Design, known as Keio Media Design or KMD, in Yokohama, Japan, from March 20th to March 23rd, 2017.

This year's conference marks TEI's eleventh anniversary and the first time in Asia. Welcome to Japan, a country of futuristic innovation with the blend of diverse culture and aesthetics!

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.

The 11th TEI conference one year after the ten-year anniversary should set an outlook about the future directions of the community and the research. Therefore, we feel it is significant that the conference is hosted in Asia. In this new chapter, we are creating and experiencing the future together at TEI 2017. Related to past and future there is a fitting Japanese pro-verb: (On-ko-chi-shin). It means "you need to recall the past to understand the future" in English. We modified it slightly, as a tagline for our theme: "recall your past to grasp the future". More than most other academic venues in the interaction area, the TEI community understands that our mind is embodied, so to design the future we need to grasp it. We welcome contributions and experiences that touch our future lives, wellbeing, productivity etc.

TEI'17 hosts a four-day program, starting on Monday March 20th with the Graduate Student Consortium and a series of Studios that engage participants in making tangible interfaces and interactions. The main program starts with an opening keynote on Tuesday March 21st by Natalie Jeremijenko, followed by talks on tangible applications for domains ranging from health to ideation in the morning and poster, demonstration and work-in-progress sessions in the afternoon, in which projects from Student Design Challenge, with the theme of Reality from Sci- Fi are on display for audience interaction and judging. Wednesday's sessions discuss frameworks and principles for tangible interaction, present projects that make science tangible, and introduce new materials and fabrication techniques. On Thursday March 23rd, we have Seiichi Saito from Rhizomatiks giving a keynote, followed by talk sessions about novel experiences, and body and aesthetics.

This year we received 151 submissions to the Papers track. A total of 41 papers were selected after a double-blind peer review process of at least three reviewers and a meta-reviewer, resulting an acceptance rate of 27%.

For the Work-in-Progress track we received 87 submissions, which were subjected to a doubleblind peer review process of two reviewers each. This resulted in 39 accepted submissions, making for an acceptance rate of 44.8%.

Contributors
  • Keio University
  • MIT Media Lab
  • University of Colorado Boulder
  • Saarland University
  • Wellesley College
  • Keio University
  • Rochester Institute of Technology

Recommendations

Acceptance Rates

TEI '17 Paper Acceptance Rate41of151submissions,27%Overall Acceptance Rate393of1,367submissions,29%
YearSubmittedAcceptedRate
TEI '211364029%
TEI '201323728%
TEI '191103633%
TEI '181303728%
TEI '171514127%
TEI '161784525%
TEI '152226328%
TEI '141724627%
TEI '131364835%
Overall1,36739329%