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TEI '19: Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction
ACM2019 Proceeding
Publisher:
  • Association for Computing Machinery
  • New York
  • NY
  • United States
Conference:
TEI '19: Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction Tempe Arizona USA March 17 - 20, 2019
ISBN:
978-1-4503-6196-5
Published:
17 March 2019
Sponsors:

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Abstract

Welcome to ACM TEI 2019, the 13th International Conference on Tangible, Embedded and Embodied Interactions, hosted in Tempe, Arizona, United States, from the 17th to the 20th of March 2019. The TEI conference features top-tier work that addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems.

Over the past few years, TEI research has increasingly embraced hybridity, whether through material explorations of composites such as bioelectronic, on-body, or active materials, or theoretical inquiries into socio-technical systems as hybrid assemblies. Not confined to a single approach, we have seen advancements in new materials-such as conductive and thermochromic inks, OLEDs, biosensors, or bioelectronics-which have helped to embed computing in the physical world. Simultaneously, comparisons between tangible computing and crafting traditions-such as crocheting or weaving-have served to destabilize assumptions about 'low' and 'high' technologies, the cultures that surround them, and even which communities have been able to participate in the discussion. These hybrid, materially-oriented approaches are radically changing our understanding of what tangible interaction looks and feels like. The theme of Hybrid Materials will continue to catalyze this exciting trend of tangible interaction research at the intersection of social, technical, biological, and artistic systems.

The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances. TEI 2019 hosts a four-day program, starting on Sunday, March 17th with the Graduate Student Consortium and a series of five Studios that engage participants in the concrete making of novel interfaces and interactions. The main program starts on Monday, March 18th with an opening keynote by Dr. Batya Friedman, which sets out to inspire reflection and action on the TEI community's engagement with human values and material matters. The keynote us followed by a series of talks on "Users with Abilities" and "Learning & Entertainment", followed by a hands-on session showcasing Work-in-Progress demonstrations as well as exemplar demos and posters of the full papers accepted to the proceedings.

Tuesday, March 19th starts with an exhibit of Student Design Challenge submissions that speculate on how humans will interact with future digital, physical, biological, social, and virtual materials, as well as the Graduate Student Consortium poster session. This is followed by a paper talks session titled "Matters Shape, Shape Matters". TEI is then hosting a Diversity and Inclusion Lunch, the first event of its kind at TEI. Organized by invited speaker Dr. Gopinaath Kannabiran, this event aims to 1) create and strengthen the diverse networks of our attendees and support mentorships across academia, research, and industry for those with traditionally marginalized backgrounds; and 2) reflect on current diversity/inclusion research and develop an agenda for future TEI work to explore previously under-studied diversity/inclusion themes. The afternoon features another hands-on session showcasing the remainder of the Work-in-Progress as well as demonstrations and posters of the full papers accepted to the proceedings.

The evening of March 19th finds the conference at the Tempe Center for the Arts (TCA), premier arts venue, which hosts Hybrid Materials: TEI Arts and Performance track. The evening begins with an exhibition of twelve art installations in the TCA Studio, followed by six live performances exploring hybridity on the TCA Theatre Stage. A total of 18 curated artworks are presented over the course of the evening, which is also open to the public.

On Wednesday, March 20th, paper talks are presented in sessions titled "Creating Together", "Move & Feel", and "How You Make It". The conference concludes with a closing keynote on "Design Experiments in Civics", presented by Dr. Carl DiSalvo to envision how design can support our lives in turbulent times.

This year we received 110 submissions to the Papers track. A total of 36 papers were selected after a double-blind peer review process of at least three reviewers and a meta-reviewer, resulting in an acceptance rate of 33%. These works are presented in three formats throughout the conference: fifteen of the works are presented as talks, eight are shown as a talk and a demo, while six are exhibited as posters, and seven are featured as demos. Our program also includes one talk and demo presentation of a full paper from the journal of Human-Computer Interaction.

For the Work-in-Progress track, we received 44 submissions, which were subjected to a doubleblind peer review process of at least two reviewers each. This resulted in 29 accepted submissions, making for an acceptance rate of 66%. For the Arts track, we received 41 submissions, subject to a four-person curation committee who performed the selection based on the artistic merits of the work and their engagement with issues relevant to the field of tangible and embedded interactive art. 18 submissions (44%) were shown at the conference.

Contributors
  • Arizona State University
  • University of Twente
  • Simon Fraser University
  • KU Leuven
  • Arizona State University

Index Terms

  1. Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction
    Index terms have been assigned to the content through auto-classification.

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    Acceptance Rates

    TEI '19 Paper Acceptance Rate36of110submissions,33%Overall Acceptance Rate393of1,367submissions,29%
    YearSubmittedAcceptedRate
    TEI '211364029%
    TEI '201323728%
    TEI '191103633%
    TEI '181303728%
    TEI '171514127%
    TEI '161784525%
    TEI '152226328%
    TEI '141724627%
    TEI '131364835%
    Overall1,36739329%