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Erschienen in: Experimental Mechanics 4/2023

09.02.2023 | Research paper

Creep Characterization of Amorphous SiO2 in the Transmission Electron Microscope Using Digital Image Correlation and Finite Element Analysis

verfasst von: Y. Zhang, S. Dillon, J. Lambros

Erschienen in: Experimental Mechanics | Ausgabe 4/2023

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Abstract

Background

Amorphous silica (a-SiO2) exhibits creep behavior under electron beam irradiation in the transmission electron microscope (TEM) even at room temperature. This effect is invariably present during in situ TEM microscale mechanical testing of a-SiO2, thus necessitating creep characterization of this material in the TEM environment.

Objective

In this paper, we extract creep properties of a-SiO2 during electron beam irradiation induced creep (IIC) by combining experimental measurements with a 2D finite element model (FEM) based on an assumed creep behavior modeled by power creep law.

Methods

Micron sized a-SiO2 beam samples deposited with gold nanoparticles are machined by focused ion beam milling and loaded in the TEM via indentation. The applied load-displacement profile at the loading point is recorded by the indenter, while full-field deformation is measured from the TEM images by correlating deformed and undeformed nanoparticle speckle patterns using digital image correlation (DIC).

Results

The elastic modulus and creep properties are obtained by solving an inverse problem in the FEM analysis based on the experimentally measured load-displacement data, and are validated by full-field displacement comparisons between FEM results and DIC measurements.

Conclusion

FEM and DIC results show good agreement, indicating applicability of the power creep model and the accuracy of extracted creep properties. A linear dependance between creep strain rate and applied stress is derived. Possible error sources from both the experiment and simulation are discussed.

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Metadaten
Titel
Creep Characterization of Amorphous SiO2 in the Transmission Electron Microscope Using Digital Image Correlation and Finite Element Analysis
verfasst von
Y. Zhang
S. Dillon
J. Lambros
Publikationsdatum
09.02.2023
Verlag
Springer US
Erschienen in
Experimental Mechanics / Ausgabe 4/2023
Print ISSN: 0014-4851
Elektronische ISSN: 1741-2765
DOI
https://doi.org/10.1007/s11340-022-00937-4

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