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Erschienen in: Journal of Electronic Materials 6/2023

17.03.2023 | Original Research Article

Interfacial Reactions in Ni/Sb2Te3 and Co0.2Ni0.8/Sb2Te3 Couples

verfasst von: Sinn-wen Chen, Yun-hung Lai, Jia–Ruei Chang

Erschienen in: Journal of Electronic Materials | Ausgabe 6/2023

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Abstract

Sb2Te3 is an important thermoelectric material. The interfacial reactions in the Ni/Sb2Te3 and Co0.2Ni0.8/Sb2Te3 couples are examined to verify if Ni and Co0.2Ni0.8 are suitable barrier layer materials. The Ni-Sb-Te phase equilibria isothermal sections and Co-Ni-Sb-Te isothermal tetrahedrons are proposed to provide fundamental information and for better understanding of the interfacial reactions. Only one reaction phase, λ2-NiSb1−xTe2x, is observed in the Ni/Sb2Te3 couples reacted at 200°C, 300°C, and 400°C. When reacting at 500°C for 6 h, the reaction phase is λ1-Ni(Sb1−xTex)1+y. With a longer reaction time, the second phase, Ni5.66SbTe2, is formed. Note, the compositional ratios of Sb/Te of all the reaction phases remain as 2/3. The result indicates that Ni is the dominating diffusion species. The reaction results in the Co0.2Ni0.8/Sb2Te3 couples are similar to those in the Ni/Sb2Te3 couples. The reaction phase at 400°C is λ2-NiSb1−xTe2x , and are λ1-Ni(Sb1−xTex)1+y + Ni5.66SbTe2 phases at 500°C with a longer reaction time. The compositional ratios of Sb/Te in the reaction phases are also 2/3, and the Co contents in the reaction phases are very limited. Ni is also the dominating diffusion species in the Co0.2Ni0.8/Sb2Te3 couples.

Graphical Abstract

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Metadaten
Titel
Interfacial Reactions in Ni/Sb2Te3 and Co0.2Ni0.8/Sb2Te3 Couples
verfasst von
Sinn-wen Chen
Yun-hung Lai
Jia–Ruei Chang
Publikationsdatum
17.03.2023
Verlag
Springer US
Erschienen in
Journal of Electronic Materials / Ausgabe 6/2023
Print ISSN: 0361-5235
Elektronische ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-023-10332-x

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