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Journal of Electronic Materials
Erschienen in: Journal of Electronic Materials 6/2023

04.04.2023 | Original Research Article

Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging

verfasst von: Zhongyang Deng, Guisheng Zou, Hongqiang Zhang, Qiang Jia, Wengan Wang, Ying Wu, A. Zhanwen, Bin Feng, Lei Liu

Erschienen in: Journal of Electronic Materials | Ausgabe 6/2023

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Abstract

Achieving high strength and reliable bonding below 150°C using Ag nanoparticle pastes is still a challenge. This work developed an organic-free nano-Ag multilayer film consisting of a compact layer and a loose layer using pulsed laser deposition (PLD). A high shear strength of 71.2 MPa was achieved with bonding at 150°C, well above the reported values. A value of 18.6 MPa was achieved even with bonding at 50°C, meeting the MIL-STD-883 K standard requirement. The shear strength of sintered joints was strongly dependent on the diffusion behavior and microstructure evolution of loose layers. The sub-10-nanometer grains and high quantity of lattice disorders in the Ag nanoparticles induced a high diffusion driving force, ensuring high-strength bonding inside the bondline. In addition, pre-bonding and nano-bump effects of the deposited compact layer enhanced the interfacial bonding between bondline and metalized surfaces. This work provides a promising method for robust die attachment below 150°C.
Vorheriger Artikel Design of High Baliga’s Figure-of-Merit P-GaN Gate AlGaN/GaN Heterostructure Field-Effect Transistors with P-AlGaN Field Plates
Nächster Artikel Bias Temperature Instability of a-IGZO TFTs Under Repeated Stress and Recovery

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Literatur
1.
X. Zhang, M. Wang, X. Li, Z. Ding, C. Ma, G.-Q. Lu, and Y. Mei, A method for improving the thermal shock fatigue failure resistance of IGBT modules. IEEE Trans. Power Electron. 35, 8532 (2020).CrossRef
2.
H. Zhang, W. Wang, H. Bai, G. Zou, L. Liu, P. Peng, and W. Guo, Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications. J. Alloy. Compd. 774, 487 (2019).CrossRef
3.
Z. Zhao, H. Zhang, G. Zou, H. Ren, W. Zhuang, L. Liu, and Y.N. Zhou, A predictive model for thermal conductivity of nano-Ag sintered interconnect for a SiC die. J. Electron. Mater. 48, 2811 (2019).CrossRef
4.
C. Chen, Z. Zhang, C. Choe, D. Kim, S. Noh, T. Sugahara, and K. Suganuma, Improvement of the bond strength of Ag sinter-joining on electroless Ni/Au plated substrate by a one-step preheating treatment. J. Electron. Mater. 48, 1106 (2018).CrossRef
5.
N.S. Mohd Zubir, H. Zhang, G. Zou, H. Bai, Z. Deng, B. Feng, A. Wu, L. Liu, and Y.N. Zhou, Large-area die-attachment sintered by organic-free Ag sintering material at low temperature. J. Electron. Mater. 48, 7562 (2019).CrossRef
6.
W. Wang, G. Zou, Q. Jia, H. Zhang, B. Feng, Z. Deng, and L. Liu, Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics. Mater. Sci. Eng. A 793, 139894 (2020).CrossRef
7.
M.-S. Kim and H. Nishikawa, Silver nanoporous sheet for solid-state die attach in power device packaging. Scr. Mater. 92, 43 (2014).CrossRef
8.
C. Chen, S. Noh, H. Zhang, C. Choe, J. Jiu, S. Nagao, and K. Suganuma, Bonding technology based on solid porous Ag for large area chips. Scr. Mater. 146, 123 (2018).CrossRef
9.
H. Luo, C. Cai, H. Li, in 2014 15th International Conference on Electronic Packaging Technology (2014), pp. 1370–1374.
10.
M. Wang, Y.-H. Mei, J. Jin, S. Chen, X. Li, and G.-Q. Lu, Pressureless sintered-silver die-attach at 180°C for power electronics packaging. IEEE Trans. Power Electron. 36, 12141 (2021).CrossRef
11.
R. Zeiser, P. Wagner, J. Wilde, in 2012 IEEE 62nd Electronic Components and Technology Conference (2012), pp. 338–343.
12.
H. Zhang, G. Zou, L. Liu, Y. Li, H. Tong, Z. Sun, and Y.N. Zhou, A comparative study of silver nanoparticles synthesized by arc discharge and femtosecond laser ablation in aqueous solution. Appl. Phys. A 122, 1 (2016).CrossRef
13.
S. Wang, M. Li, H. Ji, and C. Wang, Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scr. Mater. 69, 789 (2013).CrossRef
14.
X. Liu, J. Li, L. Liu, P. Zhu, T. Zhao, R. Sun, in 2021 IEEE 71st Electronic Components and Technology Conference (2021), pp. 532–537
15.
S. Soichi and K. Suganuma, Low-temperature and low-pressure die bonding using thin Ag-flake and Ag-particle pastes for power devices. IEEE Trans. Compon. Packag. Manuf. Technol. 3, 923 (2013).CrossRef
16.
B. Feng, D. Shen, W. Wang, Z. Deng, L. Lin, H. Ren, A. Wu, G. Zou, L. Liu, and Y.N. Zhou, Cooperative bilayer of lattice-disordered nanoparticles as room-temperature sinterable nanoarchitecture for device integrations. ACS Appl. Mater. Interfaces 11, 16972 (2019).CrossRef
17.
L. Gopi Reddy, L. Tolbert, and B. Ozpineci, Power cycle testing of power switches: a literature survey. IEEE Trans. Power Electron. 30, 2465 (2014).
18.
D.B. Geohegan, A.A. Puretzky, and D.J. Rader, Gas-phase nanoparticle formation and transport during pulsed laser deposition of Y1Ba2Cu3O7−d. Appl. Phys. Lett. 74, 3788 (1999).CrossRef
19.
W.O. Siew, S.S. Yapl, T.K. Yong, C.H. Nee, and T.Y. Tou, Effects of phase explosion in pulsed laser deposition of nickel thin film and sub-micron droplets. Appl. Surf. Sci. 257, 2775 (2011).CrossRef
20.
G. Zou, J. Yan, F. Mu, A. Wu, J. Ren, A. Hu, and Y.N. Zhou, Low temperature bonding of Cu metal through sintering of Ag nanoparticles for high temperature electronic application. Open Surf. Sci. J. 3, 70 (2011).CrossRef
21.
J. Yan, G. Zou, A. Wu, J. Ren, J. Yan, A. Hu, and Y.N. Zhou, Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging. Scr. Mater. 66, 582 (2012).CrossRef
22.
Z. Wu, J. Cai, J. Wang, Z. Geng, and Q. Wang, Low-temperature Cu-Cu bonding using silver nanoparticles fabricated by physical vapor deposition. J. Electron. Mater. 47, 988 (2017).CrossRef
23.
W. Guo, Z. Zeng, X. Zhang, P. Peng, and S. Tang, Low-temperature sintering bonding using silver nanoparticle paste for electronics packaging. J. Nanomater. 2015, 1 (2015).
24.
H. Ren, G. Zou, Z. Zhao, M. Wan, H. Zhang, Q. Jia, and L. Liu, High-reliability wireless packaging for high-temperature SiC power device sintered by novel organic-free nanomaterial. IEEE Trans. Compon. Packag. Manuf. Technol. 10, 1953 (2020).CrossRef
25.
A. Bajwa, E. Möller, J. Wilde, in 2015 IEEE 65th Electronic Components and Technology Conference (2015), pp. 2168–2174.
26.
Z. Zhang, C. Chen, A. Suetake, M.-C. Hsieh, and K. Suganuma, Reliability of Ag sinter-joining die attach under harsh thermal cycling and power cycling tests. J. Electron. Mater. 50, 6597 (2021).CrossRef
27.
A. Otto, T. Schröder, R. Dudek, W.-S. Wang, M. Baum, M. Wiemer, R. Döring, J.J. Kurian, K. Murayama, and K. Oi, Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame. PCIM Europe 2018, 1 (2018).
28.
F. Wakai, M. Yoshida, Y. Shinoda, and T. Akatsu, Coarsening and grain growth in sintering of two particles of different sizes. Acta Mater. 53, 1361 (2005).CrossRef
29.
Y. Wu, G. Zou, S. Wang, W. Guo, H. Zhang, P. Peng, B. Feng, and L. Liu, Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging. Appl. Surf. Sci. 603, 154422 (2022).CrossRef
30.
M.-H. Roh, H. Nishikawa, S. Tsutsumi, N. Nishiwaki, K. Ito, K. Ishikawa, A. Katsuya, N. Kamada, and M. Saito, Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging. J. Mater. Sci. Mater. Electron. 29, 3800 (2018).CrossRef
31.
Z. Deng, G. Zou, Q. Jia, B. Feng, H. Zhang, H. Ren, and L. Liu, Effect of Ag sintered bondline thickness on high-temperature reliability of SiC power devices. IEEE Trans. Compon. Packag. Manuf. Technol. 11, 1889 (2021).CrossRef
32.
C. Chen, Y. Gao, Z.-Q. Liu, and K. Suganuma, 3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste. Scr. Mater. 179, 36 (2020).CrossRef
33.
Z.Z. Fang and H. Wang, Densification and grain growth during sintering of nanosized particles. Int. Mater. Rev. 53, 326 (2013).CrossRef
34.
Q. Jiang, S.H. Zhang, and J.C. Li, Grain size-dependent diffusion activation energy in nanomaterials. Solid State Commun. 130, 581 (2004).CrossRef
Metadaten
Titel
Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging
verfasst von
Zhongyang Deng
Guisheng Zou
Hongqiang Zhang
Qiang Jia
Wengan Wang
Ying Wu
A. Zhanwen
Bin Feng
Lei Liu
Publikationsdatum
04.04.2023
Verlag
Springer US
Erschienen in
Journal of Electronic Materials / Ausgabe 6/2023
Print ISSN: 0361-5235
Elektronische ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-023-10358-1

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