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Published in: Journal of Materials Science 13/2007

01-07-2007

A comparison of impression and compression creep behavior of polycrystalline Sn

Authors: C. Park, X. Long, S. Haberman, S. Ma, I. Dutta, R. Mahajan, S. G. Jadhav

Published in: Journal of Materials Science | Issue 13/2007

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Abstract

This paper reports on the application of a miniaturized impression creep test to measure the creep behavior of pure polycrystalline Sn, and compares the results to compression creep data on the same sample, in order to experimentally determine a scaling constant to formulate the equivalent uniaxial creep constitutive law from the impression creep data. The creep parameters determined via impression and compression creep are found to be identical, with n ∼ 5 and Q ∼ 42 kJ/mol, indicating that over the tested stress–temperature range, the mechanism is core diffusion controlled dislocation creep. In conjunction with results from previous modeling work, a single conversion factor, κn/C, which depends on material properties, is shown to be usable for converting the impression creep relation to the equivalent uniaxial creep relation, and the experimentally determined value of κn/C for polycrystalline Sn is very close to that obtained via modeling.

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Footnotes
1
The punch stresses used in the impression creep tests were about three times larger than the corresponding stresses utilized in the compression creep tests, since σp∼ 3σ [1521].
 
2
The curve fit produces a correlation coefficient R = 0.891 with n = 5.076. The error in Aimp is ±1.74  ×  1011 K/(MPa-s).
 
3
Since the Q calculation is based on only three experimental data points, it shows a large standard deviation (±10.18 kJ/mol), although the fit is reasonable (R = 0.97).
 
4
The curve fit produces R = 0.892 with n = 5.05, the resultant error in A being ±1.58  ×  1014 K/(MPa-s).
 
Literature
1.
go back to reference Dutta I, Park C, Choi S (2004) Mater Sci Eng A379:401 Dutta I, Park C, Choi S (2004) Mater Sci Eng A379:401
2.
3.
4.
go back to reference Adeva P, Caruanna G, Ruano OA, Torralba M (1995) Mater Sci Eng A194:17 Adeva P, Caruanna G, Ruano OA, Torralba M (1995) Mater Sci Eng A194:17
6.
go back to reference Suh SH, Cohen JB, Weertman J (1983) Metall Trans 14A:117 Suh SH, Cohen JB, Weertman J (1983) Metall Trans 14A:117
7.
8.
go back to reference Song HG, Morris JW, Hua F (2002) Mater Trans (Japan) 43:184 Song HG, Morris JW, Hua F (2002) Mater Trans (Japan) 43:184
9.
go back to reference Pan D, Marks RA, Dutta I, Mahajan R, Jadhav SG (2004) Rev Sci Instrum 75:5244CrossRef Pan D, Marks RA, Dutta I, Mahajan R, Jadhav SG (2004) Rev Sci Instrum 75:5244CrossRef
10.
11.
go back to reference Marks RA, Pan D, Dutta I, Jadhav SG (2004) Proc. 9th intersociety conf. on thermal and thermomechanical phenomena in electronic systems, IEEE/ASME, pp 95–102 Marks RA, Pan D, Dutta I, Jadhav SG (2004) Proc. 9th intersociety conf. on thermal and thermomechanical phenomena in electronic systems, IEEE/ASME, pp 95–102
12.
go back to reference Dutta I, Pan D, Jadhav S, Mahajan R (2005) Proc. InterPACK 2005 (Intl. Electronic Packaging Technology Conference), ASME, Paper No. 73408, pp 189–195 Dutta I, Pan D, Jadhav S, Mahajan R (2005) Proc. InterPACK 2005 (Intl. Electronic Packaging Technology Conference), ASME, Paper No. 73408, pp 189–195
13.
16.
go back to reference Sargent PM, Ashby MF (1992) Mater Sci Technol 8:594 Sargent PM, Ashby MF (1992) Mater Sci Technol 8:594
17.
go back to reference Yu HY, Imam MA, Rath BB (1995) In: Chu SNG, Liaw PK, Arsenault RJ, Sadananda K, Chan KS, Gerberich WW, Chau CC, Kung TM (eds) Micromechanics of advanced materials. The Materials Metals & Materials Society Yu HY, Imam MA, Rath BB (1995) In: Chu SNG, Liaw PK, Arsenault RJ, Sadananda K, Chan KS, Gerberich WW, Chau CC, Kung TM (eds) Micromechanics of advanced materials. The Materials Metals & Materials Society
19.
go back to reference Sastry DH, Murthy GS (1986) Trans Ind Inst Met 39:369 Sastry DH, Murthy GS (1986) Trans Ind Inst Met 39:369
20.
21.
go back to reference Chinh NQ, Tasnadi P, Juhasz A, Szommer P, Szep-Kiss E, Kovacs I (1994) Key Eng Mater 97–98:159CrossRef Chinh NQ, Tasnadi P, Juhasz A, Szommer P, Szep-Kiss E, Kovacs I (1994) Key Eng Mater 97–98:159CrossRef
22.
go back to reference Yang FQ, Li JCM, Shih CW (1995) Mater Sci Eng A201:50 Yang FQ, Li JCM, Shih CW (1995) Mater Sci Eng A201:50
25.
go back to reference Bokshtein SZ (Samuil Zeilikovich) (1961) Investigation of the structure of metals by radioactive isotope methods. State Publishing House, Moscow Bokshtein SZ (Samuil Zeilikovich) (1961) Investigation of the structure of metals by radioactive isotope methods. State Publishing House, Moscow
26.
Metadata
Title
A comparison of impression and compression creep behavior of polycrystalline Sn
Authors
C. Park
X. Long
S. Haberman
S. Ma
I. Dutta
R. Mahajan
S. G. Jadhav
Publication date
01-07-2007
Published in
Journal of Materials Science / Issue 13/2007
Print ISSN: 0022-2461
Electronic ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-006-0542-5

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