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2006 | OriginalPaper | Chapter

A New Method for Local Strain Field Analysis Near Cracks in Micro- and Nanotechnology Applications

Authors : B. Michel, D. Vogel, N. Sabate, D. Lieske

Published in: Fracture of Nano and Engineering Materials and Structures

Publisher: Springer Netherlands

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The paper presents a new reliability approach based on local stress and deformation analysis by means of digital image correlation methods. The so-called nanoDAC- (

eformation

nalysis by

orrelation technique) method is applied in connection with creep and fatigue crack evaluation concepts. This will lead to improved lifetime estimations of microsolder joints in electronic packaging and in MEMS and NEMS interconnection technologies as well.

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