Advertisement
Published in:
2019 | OriginalPaper | Chapter
Ageing Models and Reliability Prediction
Authors : Renaud Gillon, Aarnout Wieers, Frederik Deleu, Tomas Gotthans, Rick Janssen, Wim Schoenmaker, E. Jan W. ter Maten
Published in: Nanoelectronic Coupled Problems Solutions
Publisher: Springer International Publishing
Activate our intelligent search to find suitable subject content or patents.
Select sections of text to find matching patents with Artificial Intelligence. powered by
Select sections of text to find additional relevant content using AI-assisted search. powered by
We overview reliability related activities like ageing and life time prediction. We want to predict the number of thermal stress cycles an IC can handle before showing passivation cracks. For this a sufficient model for electro-migration was used that can be applied to an IC with multiple drivers and knowing a required thermal profile. At first state-of-the-art reliability concepts are reviewed. Next a new framework is introduced that aims at simplifying and speeding-up the process of assessing the reliability of complex application profiles.