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2018 | OriginalPaper | Chapter

Analysis on the Causes of Bad PCBA Heavy Tin

Author : Junjie Lv

Published in: Advances in Intelligent Systems and Interactive Applications

Publisher: Springer International Publishing

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Abstract

The emergence of PCBA heavy disc soldering tin bad phenomena in two times of furnace process, the failure of the pad, a furnace a pad, not a furnace of solder surface observation, analysis of the FIB sample preparation section, the reason to search the AES failure surface composition analysis. The results showed that: the the failure pad at second times in front of the furnace has been oxidized, and the pad surface tin thickness dramatically thinned, resulting in a pad of tin.

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previous chapter Constructing and Analysis of the State Spaces of Workflow Process Models
next chapter Characteristics of Solder Paste and Reflow Process Analysis
Literature
1.
Zhangsi, S.: The electroless tin process of printed circuit information, 5 (2011)
2.
Fu, L., Bin, L.: Do you understand tin? Printed circuit information, 9 (2012)
3.
Fu, L., Bin, L., Xiaojin, G.: Welding failure analysis of printed circuit information method. PCB sink tin, 3 (2014)
4.
Al-Sakran, HO.: Framework architecture for improving healthcare information systems using agent technology. Int. J. Managing Inf. Technol. (IJMIT) 7(1) (Feb 2015)
5.
Devi, CS., Ramani, GG., Pandian, JA.: Intelligent E-Healthcare Management System in Medicinal Science. Int. J. PharmTech Res. 6(6), pp 1838–1845 (Oct-Nov 2014)
Metadata
Title
Analysis on the Causes of Bad PCBA Heavy Tin
Author
Junjie Lv
Copyright Year
2018
Book
Advances in Intelligent Systems and Interactive Applications

Print ISBN: 978-3-319-69095-7

Electronic ISBN: 978-3-319-69096-4

Copyright Year: 2018

DOI
https://doi.org/10.1007/978-3-319-69096-4_118

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