Characterization on White Etching Layer Formed During Ceramic Milling of Inconel 718

A comprehensive characterization of the near surface formed during the interrupted high-speed dry ceramic milling of IN718 was performed using light imaging, SEM/EDX, TEM and nano-hardness methods. It was found out that even an initial cut by a fresh tool creates a sub-surface alteration roughly 20 µm deep. The depth of altered sub-surface progressively changed to a roughly 40 µm when the tool reached an approximately half of its life, and almost 60 µm at the tool’s end of the life. In the last two cases, the visible WEL (utilizing a light microscope) of the thickness roughly 6 and 15 µm was created, respectively. The outermost layer of the deformed subsurface was found to be for all three cases approximately 1.5 µm thick and composed of dynamically recrystallized γ phase grains with the average diameter of approximately 150 nm. This layer was free of δ phase and γ′ or γ″ precipitates. It was followed by a plastically deformed zone.