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IST International Surface Technology

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01-09-2023 | Parts Cleaning

Clean Bond Surfaces During Wire Bonding

Author: acp systems AG

Published in: IST International Surface Technology | Issue 3/2023

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Ultrasonic wire bonding has been established as a contacting method in the microelectronics and semiconductor industries for many years. The bonding technology is also among the first choice for the electrical interconnection of battery cells. At a supplier for wire bonders and bond testers, snow jet cleaning ensures the necessary clean bond surface. …

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Title: Clean Bond Surfaces During Wire Bonding
Author: acp systems AG
Publication date: 01-09-2023
Publisher: Springer Fachmedien Wiesbaden
Published in: IST International Surface Technology / Issue 3/2023
Print ISSN: 1865-4827
Electronic ISSN: 2192-8703
DOI: https://doi.org/10.1007/s35724-022-1131-0

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