Top

Journal of Materials Science

Published in:

01-04-2010 | HTC2009

Experimental study of density, surface tension, and contact angle of Sn–Sb-based alloys for high temperature soldering

Authors: Yu. Plevachuk, W. Hoyer, I. Kaban, M. Köhler, R. Novakovic

Published in: Journal of Materials Science | Issue 8/2010

Activate our intelligent search to find suitable subject content or patents.

search-config

AI-assisted search

Off

Abstract

The density and the surface tension of binary Sn–Sb and ternary Sn–Sb–Cu liquid alloys have been measured over a wide temperature range by the sessile-drop method. The experimental data for the surface tension were analyzed by the Butler thermodynamic model. Investigations of the wetting behavior of these alloys on the Cu and Ni substrates in a vacuum were also performed.

previous article Interaction between liquid aluminum and yttria substrate: microstructure characterization and thermodynamic considerations

next article Wetting of grain boundaries in Al by the solid Al3Mg2 phase

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

inform now

Gayle F, Becka G, Badgett J, Whitten G, Pan T, Grusd A, Bauer B, Lathrop R, Slattery J, Anderson I, Foley J, Gickler A, Napp D, Mather J, Olson C (2001) JOM 53(6):17CrossRef

Lee HT, Chen MH, Jao HM, Hsu CJ (2004) J Electron Mater 33:1048CrossRefADS

Chen S, Chen P, Wang C (2006) J Electron Mater 35:1982CrossRefADS

Gasior W, Moser Z, Pstrus J (2003) J Phase Equilib 24(6):504CrossRef

Lee BJ, Lee HM (1997) In: Mahidhara RK et al (eds) Design and reliability of solder and solder interconnections. TMS, Warrendale, PA, p 129

Jang JW, Kim PG, Tu KN (1999) J Mater Res 14:3895CrossRefADS

Kim JH, Jeong SW, Lee HM (2002) Mater Trans 43:1873CrossRef

Iida T, Guthrie RIL (1993) The physical properties of liquid metals. Clarendon Press, Oxford

Gruner S, Köhler M, Hoyer W (2009) J Alloys Compd 482:335CrossRef

10.

Rotenberg Y, Boruvka L, Neumann AW (1983) J Colloid Interface Sci 93:169CrossRef

11.

Butler JAV (1932) Proc Roy Soc A135:348ADS

12.

Tanaka T, Hack K, Hara S (1999) MRS Bull 24:45

13.

Keene BJ (1993) Int Mater Rev 38(4):157

14.

Gasior W, Moser Z, Pstrus J (2001) J Phase Equilib 22:20

15.

Hultgren R, Desai PD, Hawkins DT, Gleiser M, Kelly KK (1973) Selected values of thermodynamics properties of binary alloys. ASM International, Metals Park, OH, pp 1300–1305

16.

Jönsson B, Ågren J (1986) Mater Sci Technol 2:913

17.

Miettinen J (2004) Calphad 28:71CrossRef

18.

Liu XJ, Wang CP, Ohnuma I, Kainuma R, Ishida K (2000) J Phase Equilib 21:432CrossRef

19.

Rizvi MJ, Chan YC, Bailey C, Lu H, Islam MN, Wu BY (2005) J Electron Mater 34:1115CrossRefADS

20.

Gnecco F, Ricci E, Amore S, Giuranno D, Borzone G, Zanicchi G, Novakovic R (2007) Int J Adhes Adhes 27(5):409CrossRef

21.

Amore S, Ricci E, Borzone G, Novakovic R (2008) Mater Sci Eng A Struct Mater A495(1–2):108CrossRef

22.

Ghosh G (2001) Acta Mater 49:2609CrossRef

23.

Rizvi MJ, Lu H, Bailey C (2009) Thin Solid Films 517:1686CrossRefADS

24.

Gubzhokov MM, Ponegev MKh, Sozaeva AB, Sozaev VA (2008) J Phys Conf Series 98:062028CrossRef

Title: Experimental study of density, surface tension, and contact angle of Sn–Sb-based alloys for high temperature soldering
Authors: Yu. Plevachuk
W. Hoyer
I. Kaban
M. Köhler
R. Novakovic
Publication date: 01-04-2010
Publisher: Springer US
Published in: Journal of Materials Science / Issue 8/2010
Print ISSN: 0022-2461
Electronic ISSN: 1573-4803
DOI: https://doi.org/10.1007/s10853-009-4120-5

Springer Professional

Abstract

Please log in to get access to your license.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Other articles of this Issue 8/2010

Wettability of SiC and alumina particles by liquid Bi under liquid Al

Effect of Nb + Ti coating on the wetting behavior, interfacial microstructure, and mechanical properties of Al/Al2O3 joints

The optimum contact angle range for metal foam stabilization: an experimental comparison with the theory

Wetting dynamics versus interfacial reactivity of AlSi alloys on carbon

Interfacial properties of immiscible Co–Cu alloys

Surface tension and density measurement of liquid Si–Cu binary alloys

Premium Partners