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Published in:
In Situ Analysis of Incipient Melting in a Novel High Strength Al–Cu Cast Alloy Using Laser Scanning Confocal Microscopy (LSCM) Read chapter Read first chapter

2020 | OriginalPaper | Chapter

Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature

Authors : Chuantong Chen, Chanyang Choe, Aiji Suetake, Katsuaki Suganuma

Published in: TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings

Publisher: Springer International Publishing

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Abstract

Sinter silver (Ag) paste has been considered as promising joint materials for SiC and GaN power modules due to its excellent thermo-stability and high electrical/thermal conductivity. Here, we investigated the mechanical properties of sintered Ag paste including fatigue and creep from room temperature to high temperature (≥200 °C), which strongly related with reliability and lift time of power modules. At the room temperature, the sample did not break even at 10 to the 6th power when the stress amplitude was less than 4 MPa. From the S-N curve, the fatigue is close to the Morrow equation but not is the Coffin–Manson law. In addition, in the case of high temperature test (200 °C), the fracture behavior is different with room temperature, large deformation appeared at the necking part of the sintered Ag paste for both fatigue and creep test.

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previous chapter Bonding and High-Temperature Storage Performance of Die Attachment with Ag Paste Sintering on Bare Direct Bonding Aluminum (DBA) Substrate
next chapter Reliability Behavior of Surface Mount Devices Assembled with Bismuth Bearing Low-Melt Solder Pastes
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Metadata
Title
Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature
Authors
Chuantong Chen
Chanyang Choe
Aiji Suetake
Katsuaki Suganuma
Copyright Year
2020
Book
TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings

Print ISBN: 978-3-030-36295-9

Electronic ISBN: 978-3-030-36296-6

Copyright Year: 2020

DOI
https://doi.org/10.1007/978-3-030-36296-6_66

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