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16-02-2021

Floor Planning of 3D IC Design Using Hybrid Multi-verse Optimizer

Authors: Sivakumar Pothiraj, Jeya Prakash Kadambarajan, Pandiaraj Kadarkarai

Published in: Wireless Personal Communications | Issue 4/2021

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Abstract

Several research works have been undergone in the 3D IC floor planning concepts due to its higher demand and technological improvement. Floor planning is a complex step when there is a more number of a component on each layer of IC. Even though several researches have been done in this area, the optimization process is still not satisfied with the use of traditional mechanisms. Consequently, there is a need for effective optimization procedure in IC design. Hence, in this proposed work, hybrid multi verse optimizer floor planning is utilized where the node coordinates and dimensions are adjusted to attain the optimized floor planning with minimal wire length and area using best universes.

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Title: Floor Planning of 3D IC Design Using Hybrid Multi-verse Optimizer
Authors: Sivakumar Pothiraj
Jeya Prakash Kadambarajan
Pandiaraj Kadarkarai
Publication date: 16-02-2021
Publisher: Springer US
Published in: Wireless Personal Communications / Issue 4/2021
Print ISSN: 0929-6212
Electronic ISSN: 1572-834X
DOI: https://doi.org/10.1007/s11277-021-08166-z

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