Joining of tungsten carbide to nickel by direct diffusion bonding and using a Cu–Zn alloy

The objective of this work was to study various aspects of liquid and solid state diffusion bonding of cylindrical samples of WC (with 6% Co) and commercially pure nickel (99.5%) produced by direct bonding and brazing using a 25 μm thick 70Cu 30Zn (wt%) alloy as joining element. Joining experiments were carried out on WC/Ni and WC/Cu Zn/Ni combinations at temperature of 980 °C using 1, 15, 25 and 35 min holding times in argon (Ar). The results show that it is possible to create a successful joint at temperature and times used. Joining occurred by the formation of a diffusion zone. The joining interface is feasible because it presents a homogeneous interface with no several interfacial cracking and porosity. In both combinations, it can be observed a diffusion of cobalt decreasing in the direction of the metal, as well as, the diffusion of nickel decreasing in the direction of the ceramic.