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2012 | OriginalPaper | Chapter

7. Material Characterization for Power Electronics Packaging

Author : Yong Liu

Published in: Power Electronic Packaging

Publisher: Springer New York

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Abstract

The encapsulation of plastic power packages often produces interfacial shear stresses that can lead to failure during temperature cycling. Also surface mounted technology exposes the body of the plastic package to such high temperature during assembly that moisture-related mechanical failure of the package can occur. The selection of materials for both hermetic and nonhermetic package is influenced by the mechanical, electrical, and the thermal requirements of the power device and its surrounding electrical system and by the environmental to which the device will be exposed. The reliability of the packaged power device will depend not only on the characteristics of the individual materials but also on the interaction of package materials at interfaces during exposure to such stresses as thermal gradients, temperature cycling, moisture, and contamination.

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previous chapter Thermal Management, Design, and Cooling for Power Electronics

next chapter Power Package Typical Assembly Process

Qian Q, Liu Y, Irving S, Luk T (2007) Analysis of the impact of polyimide coating on passivation reliability by simulation. ECTC57, Reno, Nevada, USA

Zhang Z, Suo Z, Liu Y et al (2006) Methodology for avoidance of ratcheting-induced stable cracking (RISC) in microelectronic devices. ECTC56, San Diego, USA

Liu Y, Sirving S, Mark R et al (2002) Die attach delamination characterization for SOIC package. ECTC52, San Diego, USA

J-STD-20C (2004) Moisture/reflow sensitivity classification of nonhermetic sold state surface mount devices, JEDEC Solid State Technology Association

JESD22-A113D (2003) Preconditioning of nonhermetic surface mount devices prior to reliability testing, JEDEC Solid State Technology Association

JEP-122B (2003) Failure mechanisms and models for semiconductor devices, August 2003

JESD22-A120 (2003) Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits, June 2001

McKenna GB, Simon SL (2002) Handbook of thermal analysis and calorimetry. Vol. 3: applications to polymers and plastics. Elsevier Science, Amsterdam

Vrentas JS (1988) History dependence of diffusion coefficients for glassy polymer-penetrant systems. J Appl Polym Sci 36:1933–1934CrossRef

10.

Vrentas JS, Vrentas CM (2003) Diffusion in glassy polymers. J Polym Sci B Polym Phys 41:785–788CrossRef

11.

Wong EH (2000) The mechanics and impact of hygroscopic swelling of polymer materials in electronic packaging. ECTC50, Las Vegas, USA

12.

Hanfei Z (2004) Sorption studies of volatile organic compounds in a divinyl-terminated poly (dimethylsiloxane)-oligo polymer. J Appl Polym Sci 92:920–927CrossRef

13.

Tee TY (2004) Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow and interfacial fracture mechanics analysis. Microelectron Reliab 44:105–114CrossRef

14.

Liu YM, Liu Y, Yang J et al (2005) Reliability study of ceramic substrate in a SIP type package. ICEPT, Shanghai, China

15.

Wilde J (2000) Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder. IEEE Trans Adv Pack 23(3):408–414CrossRef

16.

Darveaux R, Banerji K (1992) Constitutive relations for tin-based solder joints. IEEE Trans CHMT 15(6):1013–1024

17.

Pao YH et al (1993) Constitutive behavior and low cycle thermal fatigue of 97Sn3Cu solder joints. ASME J Electron Packag 115(6):147–152CrossRef

18.

Amagai M (2002) Mechanical characterization of Sn-Ag-based lead-free solders. Microelectron Reliabil 42(6):951–966CrossRef

19.

Kim Y et al (2003) Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder. In: Proceedings of 53rd electronic components and technology conference, New Orleans, LA, May 2003, pp 891–897

20.

Rodgers B et al (2005) Experimental determination and finite element model validation of the Anand viscoplasticity model constants for SnAgCu. In: EuroSimE 2005, Berlin, Germany, April 2005, pp 490–496

21.

Reinikainen T et al (2005) Deformation characteristics and microstructural evolution of SnAgCu solder joints. In: EuroSimE 2005, Berlin, Germany, April 2005, pp 91–98

22.

Chen ZG et al (2004) Modified Anand constitutive model for lead-free solder Sn-3.5Ag. In: The ninth intersociety conference on thermal and thermomechanical phenomena in electronic systems, IEEE 2004, pp 447–452

23.

Anand L (1982) Constitutive equations for the rate-dependent deformation of metals at elevated temperatures. J Eng Mater Technol Trans ASME 104(1):12–17MathSciNetCrossRef

24.

Pei M et al (2005) Constitutive modeling of lead-free solders. In: Advances in electronic packaging 2005, IEEE, San Francisco, CA, July 2005, pp 1307–1311

Title: Material Characterization for Power Electronics Packaging
Author: Yong Liu
Publisher: Springer New York
Book: Power Electronic Packaging
Print ISBN: 978-1-4614-1052-2

Electronic ISBN: 978-1-4614-1053-9

Copyright Year: 2012
DOI: https://doi.org/10.1007/978-1-4614-1053-9_7