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Published in: Metallurgical and Materials Transactions A 2/2020

26-11-2019 | Communication

Microstructural Investigation of the Impact Weld Interface of Pseudo Single Grained Cu and Ag

Authors: Taeseon Lee, Menglin Zhu, Taylor Dittrich, Jinwoo Hwang, Anupam Vivek, Glenn S. Daehn

Published in: Metallurgical and Materials Transactions A | Issue 2/2020

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Abstract

The microstructure of the impact weld interface of pseudo single grained copper and silver is investigated. Electron backscattered diffraction shows severe plastic deformation at the weld interface and suggests that the cooling rate of the interface is fast enough to avoid conventional eutectic lamellar structure in localized melted zones. Scanning transmission electron microscopy, along with nano-diffraction and compositional analysis, demonstrates that impact welding can achieve metallurgical bonding in the solid-state without forming an amorphous structure.

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Metadata
Title
Microstructural Investigation of the Impact Weld Interface of Pseudo Single Grained Cu and Ag
Authors
Taeseon Lee
Menglin Zhu
Taylor Dittrich
Jinwoo Hwang
Anupam Vivek
Glenn S. Daehn
Publication date
26-11-2019
Publisher
Springer US
Published in
Metallurgical and Materials Transactions A / Issue 2/2020
Print ISSN: 1073-5623
Electronic ISSN: 1543-1940
DOI
https://doi.org/10.1007/s11661-019-05557-7

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