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2020 | OriginalPaper | Chapter

3. Microsystems Manufacturing Methods: Integrated Circuit Processing Steps

Author : Michael Huff

Published in: Process Variations in Microsystems Manufacturing

Publisher: Springer International Publishing

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Abstract

A general overview of the processing steps commonly used in integrated circuit (IC) manufacturing is provided in Chap. 3. How each processing step is performed, the equipment commonly used, and guidance on the expected dimensional variations when performing the processing step are given. The subsequent chapter will focus on specialized processing steps used in MEMS fabrication. The major categories of processing steps used in IC fabrication include depositions or growths; lithography; etching; impurity doping; and metrology. Depending on the process sequence involved, there may also be other types of processing steps in the sequence as well such as planarization, rapid thermal anneals, and others. A number of these processing steps will be performed sequentially to implement the ICs, and some will be repeated multiple times. Once the fabrication is completed, the wafers will usually go through a series of tests to determine their functionality and performance. This is discussed in more detail in Chaps. 7, 8, and 9. Table 3.4 provides a compilation of the expected “best-case” dimensional variations for each of the processing steps reviewed in this chapter as a quick reference.

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previous chapter An Overview of MEMS Microsystems
next chapter Microsystems Manufacturing Methods: MEMS Processes
Footnotes
1
A chemical precursor is a chemical compound that participates in a chemical reaction that produces another chemical compound.
 
2
For interested readers, more information about SUPREM can be obtained at http://​www-tcad.​stanford.​edu/​tcad/​programs/​suprem-IV.​GS/​Book.​html.
 
3
Interstitial atoms are atoms that are located in the crystal but are not part of the crystal lattice of the material.
 
4
Gaussian statistical distributions will be covered in a later chapter.
 
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Metadata
Title
Microsystems Manufacturing Methods: Integrated Circuit Processing Steps
Author
Michael Huff
Copyright Year
2020
Book
Process Variations in Microsystems Manufacturing

Print ISBN: 978-3-030-40558-8

Electronic ISBN: 978-3-030-40560-1

Copyright Year: 2020

DOI
https://doi.org/10.1007/978-3-030-40560-1_3