Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Metallurgical and Materials Transactions A
Published in: Metallurgical and Materials Transactions A 1/2017

01-11-2016 | Communication

Novel Ballistic Processing of Sn-0.7Cu Thick Films

Authors: D. Cavero, K. Stewart, K. Morsi

Published in: Metallurgical and Materials Transactions A | Issue 1/2017

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The present paper discusses a novel process (Ballistic Processing) for the ultra-rapid processing of textured and un-textured thick and potentially thin films. The effect of processing velocity (14.6 to 36.1 m/s) on the developed external structure and internal microstructure of Sn-0.7Cu thick film is discussed. Film thicknesses ranging from 6.08 to 12.79 μm were produced and characterized by two-dimensional hypoeutectic microstructures. Both film thickness and dendrite arm spacing decreased with an increase in processing velocity.
previous article Combined Intercritical Annealing and Q&P Processing of Medium Mn Steel
next article Evolution of Grain Boundary Precipitates in an Al-Cu-Li Alloy During Aging

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now
Literature
1.
S. Ando, Y. Mine, K. Takashima, S. Itoh, H. Tonda: J. Mater. Process. Technol., 1999, vol. 85, pp. 142–147.CrossRef
2.
3.
4.
H. Futterer, R. Wernhardt, J. Pelzl, M. Rosenberg: J. Non. Cryst. Solids., 1983, vol. 56 pp. 435–438.CrossRef
5.
R. Seshadri, R. V. Krishna Rao, R. V. Krishnan, R.M. Mallya: J. Mater. Sci., 1988, vol. 23, pp.1637–1642.CrossRef
6.
S. Saber-Samandari, C.C. Berndt: Int. Heat Treat. Surf. Eng., 2010, vol. 4, pp. 7–13.CrossRef
7.
K. Iizuka, M. Kambara, T. Yoshida: Sensors Actuators, B Chem., 2011, vol. 155, pp. 551–556.CrossRef
8.
T. Mineta, K. Kasai, Y. Sasaki, E. Makino, T. Kawashima, T. Shibata: Microelectron. Eng., 2009, vol. 86, pp. 1274–1277.CrossRef
9.
Y. Xiang, L. Yang, W. Cheng-Biao, L. Xin-Chun, and Y. De-Yang: Vacuum, 2005, vol. 80, pp. 324-331..CrossRef
10.
M. M. Rahman, M. Sone, H. Uchiyama, M. Sakurai, S. Miyata, T. Nagai, Y. Higo, and H. Kameyama: Surf. Coatings Technol., 2007, vol. 201, pp.7513-7518.CrossRef
11.
T. K. Gupta: Handbook of Thick- and Thin-Film Hybrid Microelectronics, John Wiley & Sons, Inc., Hoboken, 2003, pp. 163-170.CrossRef
12.
Z. Liu and D. D. L. Chung: J. Electron. Mater., 2004, vol. 33, pp. 194-202.CrossRef
13.
J. P. Chu, J. S. C. Jang, J. C. Huang, H. S. Chou, Y. Yang, J. C. Ye, Y. C. Wang, J. W. Lee, F. X. Liu, P. K. Liaw, Y. C. Chen, C. M. Lee, C. L. Li, and C. Rullyani: Thin Solid Films, 2012, vol. 520, pp.5097-5122.CrossRef
14.
V. I. Tkatch, A. I. Limanovskii, S. N. Denisenko, and S. G. Rassolov: Mater. Sci. Eng. A, 2002, vol. 323, pp. 91-96.CrossRef
15.
16.
Y.-G. Su, F. Chen, C.-M. Chang, C.-Y. Wu, M.-H. Chang, and C. A. Chung: JOM, 2014, vol. 66, pp. 1277-1286.CrossRef
17.
P. Duwez, R. Willens, and W. Klement: J. Appl. Phys., 1960, vol. 31, p.1136.CrossRef
18.
N. Zhao, X. M. Pan, D. Q. Yu, H. T. Ma, and L. Wang: J. Electron. Mater., 2009, vol. 38, pp. 828-833.CrossRef
19.
T. Ventura, S. Terzi, M. Rappaz, and A. K. Dahle: Acta Mater., 2011, vol. 59, pp. 1651-1658.CrossRef
20.
Metadata
Title
Novel Ballistic Processing of Sn-0.7Cu Thick Films
Authors
D. Cavero
K. Stewart
K. Morsi
Publication date
01-11-2016
Publisher
Springer US
Published in
Metallurgical and Materials Transactions A / Issue 1/2017
Print ISSN: 1073-5623
Electronic ISSN: 1543-1940
DOI
https://doi.org/10.1007/s11661-016-3838-3

Other articles of this Issue 1/2017

Metallurgical and Materials Transactions A 1/2017 Go to the issue

OriginalPaper

Investigation of Hot Deformation Behavior of Duplex Stainless Steel Grade 2507

OriginalPaper

Elevated Temperature Effects on the Plastic Anisotropy of an Extruded Mg-4 Wt Pct Li Alloy: Experiments and Polycrystal Modeling

OriginalPaper

Influence of Carbon Content and Rolling Temperature on Rolling Texture in 3 Pct Si Steel

Communication

Plastic Work to Heat Conversion During High-Strain Rate Deformation of Mg and Mg Alloy

OriginalPaper

Twin Interactions in Pure Ti Under High Strain Rate Compression

OriginalPaper

Stable Eutectoid Transformation in Nodular Cast Iron: Modeling and Validation

Premium Partners

    Image Credits