On-Chip Thermal Management and Hot-Spot Remediation

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in die heat flux and growing concern over the emergence of on-chip “hot spots.” The application of on-chip high heat flux cooling techniques provides a viable direction for the thermal management of such nanoelectronic components. Following a review of the relevant passive and active thermal management techniques, the physical phenomena underpinning the most promising on-chip thermal management approaches are described. Attention is devoted to thin-film and miniaturized thermoelectric coolers, orthotropic TIMs/heat spreaders, and phase-change microgap coolers for hot-spot remediation and thermal management of these nanoelectronic chips.