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2019 | OriginalPaper | Chapter

Pre-bond Testing of TSVs in 3D IC Using Segmented Cellular Automata

Authors : Bidesh Chakraborty, Mamata Dalui

Published in: Information Technology and Applied Mathematics

Publisher: Springer Singapore

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Abstract

Pre-bond testing of through silicon vias (TSVs) in 3D ICs is very challenging task. Reliability and correctness of 3D ICs consisting of numbers of TSVs have to be established. This paper presents an innovative pre-bond test method for TSVs in a 3D IC. The logic is devised around the cascadable arrangement of Cellular Automata (CA), discovered by von Neumann in the year of 1960. SACA, a designated class of CA, has been developed to diagnose conductor and insulator defects in TSVs. The segmentation of CA in the design assures more effectiveness, with respect to the number of computations to identify faulty TSVs. The implemented hardware realizes quick test of manufacturing TSV faults in the pre-bond phase.

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Metadata
Title
Pre-bond Testing of TSVs in 3D IC Using Segmented Cellular Automata
Authors
Bidesh Chakraborty
Mamata Dalui
Copyright Year
2019
Publisher
Springer Singapore
Book
Information Technology and Applied Mathematics

Print ISBN: 978-981-10-7589-6

Electronic ISBN: 978-981-10-7590-2

Copyright Year: 2019

DOI
https://doi.org/10.1007/978-981-10-7590-2_9

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