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Excerpt

With its epoxy resin adhesive 4439, Kager has developed a highly innovative two-component system that can be used not only for permanently bonding different materials and components, but also for potting and encapsulating them. The solvent-free all-rounder can withstand temperatures of between -40 and +250 °C and is therefore particularly resistant to heat and cold. Up to a temperature of 150 °C, it reveals its talents as an adhesive, while up to 250 °C it shows its capabilities as a potting compound. Immediately after the two components, the resin and the hardener, have been mixed, the epoxy resin adhesive exhibits a very low viscosity of 1,500 mPa·s and therefore has high flowability. As a result, it can easily penetrate into fine gaps and cracks during application. This makes it a highly effective joining agent for tasks in component assembly or maintenance. The fact that the adhesive cures to a relatively high level of hardness (Shore hardness of D80) also makes it predestined for encapsulating electronic and electrical assemblies to provide them with mechanical protection. …