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Journal of Failure Analysis and Prevention

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01-08-2017 | Technical Article---Peer-Reviewed

RETRACTED ARTICLE: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly

Authors: Prashant Reddy Gangidi, Noy Souriyasak

Published in: Journal of Failure Analysis and Prevention | Issue 4/2017

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Excerpt

This article has been retracted by the corresponding author as he did not have permission to publish the data. The editor has been unable to contact Noy Souriyasak regarding this retraction. The scientific content has been removed for legal reasons. …

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Title: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly
Authors: Prashant Reddy Gangidi
Noy Souriyasak
Publication date: 01-08-2017
Publisher: Springer US
Published in: Journal of Failure Analysis and Prevention / Issue 4/2017
Print ISSN: 1547-7029
Electronic ISSN: 1864-1245
DOI: https://doi.org/10.1007/s11668-017-0296-1

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