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2015 | OriginalPaper | Chapter

15. Solid State Microjoining Processes in Manufacturing

Authors : Sharon Mui Ling Nai, Murali Sarangapani, Johnny Yeung

Published in: Handbook of Manufacturing Engineering and Technology

Publisher: Springer London

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Abstract

This chapter presents the solid-state bonding technologies, in particular the thermocompression bonding and thermosonic bonding technologies, which are used to form microjoints in the electronics industry. The diffusion bonding mechanism and the key bonding conditions required to form reliable joints are presented. Moreover, the recent progresses in the thermocompression bonding and thermosonic ball-wedge bonding technologies are highlighted. Lastly, the effects of different bonding materials and their surface characteristics on the joints’ performance are also discussed.

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Title: Solid State Microjoining Processes in Manufacturing
Authors: Sharon Mui Ling Nai
Murali Sarangapani
Johnny Yeung
Publisher: Springer London
Book: Handbook of Manufacturing Engineering and Technology
Print ISBN: 978-1-4471-4669-8

Electronic ISBN: 978-1-4471-4670-4

Copyright Year: 2015
DOI: https://doi.org/10.1007/978-1-4471-4670-4_60

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