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Journal of Materials Science
Published in: Journal of Materials Science 6/2017

05-12-2016 | Original Paper

Synthesis of silver nanoparticles using large-area arc discharge and its application in electronic packaging

Authors: Hongqiang Zhang, Guisheng Zou, Lei Liu, Hao Tong, Yong Li, Hailin Bai, Aiping Wu

Published in: Journal of Materials Science | Issue 6/2017

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Abstract

Silver nanoparticles were efficiently synthesized by large-area arc discharge in liquid and were found to be effective as bonding materials in power microelectronic packaging. The results showed that the production rate of silver nanoparticles depended on the heat input during processing and reached the maximum value of 350 mg/min at current 104 A, which was much higher than any previously reported productivity by the arc discharge method. The silver nanoparticles were characterized in terms of their microstructure, morphology, particle size, and distribution. Two Gaussian peaks were found in the nanoparticle size distribution curve, which were 33 and 220 nm, respectively. This mixed-size nanoparticle paste was naturally economical and effective for the packaging application due to the combination of the high surface energy of small nanoparticles and the efficient joint filling of the large nanoparticles. The cross-section microstructure and fracture surface of bonded joints indicated that atomic bonds formed between the sintered layer and the substrates. Additionally, the mechanism of arc discharge for synthesizing the silver nanoparticles was discussed.
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Metadata
Title
Synthesis of silver nanoparticles using large-area arc discharge and its application in electronic packaging
Authors
Hongqiang Zhang
Guisheng Zou
Lei Liu
Hao Tong
Yong Li
Hailin Bai
Aiping Wu
Publication date
05-12-2016
Publisher
Springer US
Published in
Journal of Materials Science / Issue 6/2017
Print ISSN: 0022-2461
Electronic ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-016-0626-9

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