Temperature effect on the thermal properties of insulation paper

Establishing and optimizing a distributed parameter thermal path model for transformer windings is an important means to analyze the hot-spot temperature of the windings; furthermore, in the process of improving the thermal path model of transformers and improving the accuracy of their models, the thermal characteristics of the insulation paper are extremely important. A microscopic thermal contact resistance model was established for the contact interface of insulation paper and copper, according to the microscopic morphology parameters of copper and insulation paper observed by atomic force microscopy, the thermal contact resistance under different temperatures was calculated. A dual heat flow test platform was built to test the heat transfer behavior of four different thickness insulation papers under four temperatures, and the thermal contact resistance and thermal bulk resistance with temperature were analyzed. The results show that as the temperature increases, the thermal resistance of the insulation paper becomes larger and the thermal conductivity decreases. The average error between the experimental and theoretical values of the thermal contact resistance under four temperature points in the study is 6.6%. The results provide a data support for establishing and optimizing transformer heat generation and heat transfer models.