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Metallurgical and Materials Transactions A

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01-04-2008

Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders

Authors: R.S. Sidhu, N. Chawla

Published in: Metallurgical and Materials Transactions A | Issue 4/2008

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Abstract

The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading. Microstructure characterization of the initial and damaged solder-joint microstructures was studied using scanning electron microscopy (SEM). Persistent slip band formation, followed by crack nucleation and propagation at the tip of the lap-shear geometry, took place. The influence of the Sn grain orientation on the thermal fatigue damage was modeled using the finite-element method (FEM). The grain orientation was determined by orientation image mapping (OIM), and a Schmid factor analysis was performed to determine the active slip systems in the Sn grains. It was found that the geometry of the lap-shear joint, rather than the Sn grain orientation, was more significant in determining the location of crack initiation.

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Title: Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders
Authors: R.S. Sidhu
N. Chawla
Publication date: 01-04-2008
Publisher: Springer US
Published in: Metallurgical and Materials Transactions A / Issue 4/2008
Print ISSN: 1073-5623
Electronic ISSN: 1543-1940
DOI: https://doi.org/10.1007/s11661-008-9480-y

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