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Published in: Journal of Electroceramics 4/2023

26-09-2023

Thick films for high-temperature piezoelectric applications - a future reference

Authors: Sruthi S, Manoranjan Sahoo, Soma Dutta

Published in: Journal of Electroceramics | Issue 4/2023

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Abstract

The piezoelectric thick film of the active component that works at high temperatures for space and aeronautics has been in significant demand. The thick film has great technological importance as its thickness lies between the thin film and bulk material. The application, such as sensors and actuators, require a thickness that is not less than thin film or not more than bulk to be sufficiently powerful and sensitive. While the thick film is exposed to a temperature higher than room temperature, the piezoelectricity and elastic properties should not be degraded. Thus researchers have been investigating high-temperature thick films for the past decade. This review focuses on the detailed study of high-temperature piezoelectric thick films of lead-based and lead-free based materials and their composites, highlighting fabrication methods. Other important areas, such as substrates for thick film properties achieved and targeted applications, are also discussed. This discussion shows that selecting the high-temperature piezoelectric material, fabrication method, substrates, etc., are essential for fabricating a high-temperature piezoelectric transducer.

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Metadata
Title
Thick films for high-temperature piezoelectric applications - a future reference
Authors
Sruthi S
Manoranjan Sahoo
Soma Dutta
Publication date
26-09-2023
Publisher
Springer US
Published in
Journal of Electroceramics / Issue 4/2023
Print ISSN: 1385-3449
Electronic ISSN: 1573-8663
DOI
https://doi.org/10.1007/s10832-023-00331-z

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