2011 | OriginalPaper | Chapter
34. Through-Silicon via Technology for RF and Millimetre-Wave Applications
Authors : Alvin Joseph, Cheun-Wen Huang, Anthony Stamper, Wayne Woods, Dan Vanslette, Mete Erturk, Jim Dunn, Mike McPartlin, Mark Doherty
Published in: Ultra-thin Chip Technology and Applications
Publisher: Springer New York
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