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MS 1 MINISYMPOSIUM: ADVANCED IMAGING FOR INDUSTRIAL APPLICATION Read chapter Read first chapter

2016 | Supplement | Chapter

Waveform Modelling in Order to Speed Up Transient SPICE Simulations

Authors : Mohammed Ali Khozoei, Matthias Hauser, Angelo Ciccazzo

Published in: Progress in Industrial Mathematics at ECMI 2014

Publisher: Springer International Publishing

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Abstract

The production of semiconductor integrated circuits is very complex and expensive. Therefore, it is essential to verify the designed circuits before they are fabricated. Due to the process variations, nanoscale circuits have to be simulated many times during the design flow. This kind of analysis can be very expensive because of their complexity and the high number of simulations. For this reason the semiconductor industry is deeply interested in using less complex but accurate models to speed up time consuming SPICE simulations. This contribution presents a method that creates a compact model, which replaces a semiconductor integrated circuit or sub circuit to significantly reduce the transient simulation time.

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Footnotes
1
This is used in the example presented in Sect. 4.
 
2
The computation of a transient output curve with 80 points in time needs about 4 ms. Fortunately this time just depends on the number of sample points and not on the complexity of the underlying circuit.
 
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Metadata
Title
Waveform Modelling in Order to Speed Up Transient SPICE Simulations
Authors
Mohammed Ali Khozoei
Matthias Hauser
Angelo Ciccazzo
Copyright Year
2016
Book
Progress in Industrial Mathematics at ECMI 2014

Print ISBN: 978-3-319-23412-0

Electronic ISBN: 978-3-319-23413-7

Copyright Year: 2016

DOI
https://doi.org/10.1007/978-3-319-23413-7_59

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