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Published in: Empirical Software Engineering 2/2023

01-03-2023

What is asked about technical debt (TD) on Stack Exchange question-and-answer (Q&A) websites? An observational study

Authors: Reem Alfayez, Yunyan Ding, Robert Winn, Ghaida Alfayez, Christopher Harman, Barry Boehm

Published in: Empirical Software Engineering | Issue 2/2023

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Abstract

Technical debt (TD) is a term coined by agile software pioneer Ward Cunningham to account for the added software system effort or cost resulting from taking early software project shortcuts. Previous research on TD has extensively outlined and discussed the various consequences derived from accumulating TD and the difficulty in managing it. A review of the software engineering literature revealed that Stack Exchange question-and-answer (Q&A) websites can provide valuable, real world perspectives on a number of software engineering topics. Therefore, this study aims to observe how the TD term is utilized on Stack Exchange Q&A websites. Specifically, this study utilizes a dataset derived from three Stack Exchange Q&A websites, which are Stack Overflow (SO), Software Engineering (SE), and Project Management (PM), to retrieve and analyze 578 TD-related questions. The results unveiled that TD-related questions can be categorized into 14 different categories, a total of 636 unique tags are utilized in the acquired set of TD-related questions, and a few TD-related categories both lack accepted answers and have a longer median time to receive an accepted answer than other categories. This study’s findings highlight the TD-related challenges that are addressed by Stack Exchange Q&A website users, which may prove beneficial in steering future TD-related efforts.

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Metadata
Title
What is asked about technical debt (TD) on Stack Exchange question-and-answer (Q&A) websites? An observational study
Authors
Reem Alfayez
Yunyan Ding
Robert Winn
Ghaida Alfayez
Christopher Harman
Barry Boehm
Publication date
01-03-2023
Publisher
Springer US
Published in
Empirical Software Engineering / Issue 2/2023
Print ISSN: 1382-3256
Electronic ISSN: 1573-7616
DOI
https://doi.org/10.1007/s10664-022-10269-5

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