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2017 | OriginalPaper | Chapter

12. 3D/2.5D IC-Based Obfuscation

Authors : Yang Xie, Chongxi Bao, Ankur Srivastava

Published in: Hardware Protection through Obfuscation

Publisher: Springer International Publishing

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Abstract

Device scaling has increased interconnect power and delay to an extent that it is presenting a bottleneck to further performance gain. 3D/2.5D integration technology emerges as a viable option to improve chip performance in a direction orthogonal to costly device scaling. While the technology was originally proposed to enhance performance, it has unlocked new opportunities to thwart security threats in a global IC supply chain. Various obfuscation techniques based on 3D/2.5D IC technology have been proposed to protect IC designs from being pirated or tampered during outsourced fabrication. This chapter presents the current state of 3D/2.5D IC-based obfuscation techniques and highlights potential security opportunities and challenges of this technology in hardware intellectual property (IP) protection.

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previous chapter Obfuscated Built-In Self-authentication

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Title: 3D/2.5D IC-Based Obfuscation
Authors: Yang Xie
Chongxi Bao
Ankur Srivastava
Publisher: Springer International Publishing
Book: Hardware Protection through Obfuscation
Print ISBN: 978-3-319-49018-2

Electronic ISBN: 978-3-319-49019-9

Copyright Year: 2017
DOI: https://doi.org/10.1007/978-3-319-49019-9_12

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