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Published in: Journal of Materials Science: Materials in Electronics 7/2015

01-07-2015

A comparative study of atomic layer deposition of Al2O3 and HfO2 on AlGaN/GaN

Authors: Xiaoye Qin, Lanxia Cheng, Stephen McDonnell, Angelica Azcatl, Hui Zhu, Jiyoung Kim, Robert M. Wallace

Published in: Journal of Materials Science: Materials in Electronics | Issue 7/2015

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Abstract

The atomic layer depositions of Al2O3 and HfO2 on AlGaN/GaN were systematically studied. The band alignments of Al2O3/AlGaN and HfO2/AlGaN were investigated using in situ X-ray photoelectron spectroscopy. A conduction band offset of 1.8 and 1.1 eV were observed for Al2O3/AlGaN and HfO2/AlGaN, respectively. The Al2O3 and HfO2 dielectric layers were found to reduce the leakage current as expected with respect to metal/AlGaN/GaN Schottky diodes, but neither changes the surface states of AlGaN. The positive ionized surface donor states density and average interface state density (D it ) below the AlGaN conduction band edge (0.34 < E C   E T  < 0.50 eV), extracted from capacitance voltage (C–V) curves, were ~5 × 1013 cm−2 and 1.1 × 1014 cm−2 eV−1, respectively.

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Metadata
Title
A comparative study of atomic layer deposition of Al2O3 and HfO2 on AlGaN/GaN
Authors
Xiaoye Qin
Lanxia Cheng
Stephen McDonnell
Angelica Azcatl
Hui Zhu
Jiyoung Kim
Robert M. Wallace
Publication date
01-07-2015
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 7/2015
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-2926-2

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