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Experimental Mechanics

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24-01-2024 | Research paper

A Label-Free Measurement Method for Plane Stress States in Optical Isotropic Films with Spectroscopic Ellipsometry

Authors: X. Sun, S. Wang, W. Xing, X. Cheng, L. Li, C. Li, Z. Wang

Published in: Experimental Mechanics | Issue 3/2024

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Abstract

Background

Stress measurement for thin films is crucial in a variety of fields such as in semiconductor manufacturing, the optoelectronics industry, and biomedical science, among others. However, most measurement methods require surface treatment of the thin film.

Objective

A label-free measurement method for plane stress states in optical isotropic thin films based on spectroscopic ellipsometry analysis is proposed and verified in this paper.

Methods

The proposed method is based on the modulation of the stress-optic effect on reflected spectroscopic ellipsometry. A theoretical model is established to describe the relation between all components of the plane-stress state and the classic ellipsometric parameters (Ψ, Δ). An algorithm is developed to determine all components of a plane-stress state by fitting the model to the experiment data.

Results

In the verification experiment, we determined the plane stress state of a Cu film coated on a PI (polyimide) substrate. The results show a reasonable agreement between the experimental measurements from spectroscopic ellipsometry and the theoretical analysis based on the applied loading.

Conclusion

The results prove that our method can effectively measure the plane stress state of optical isotropic thin films.

previous article A New Brazilian Disc Test Procedure for the Elastic Moduli of Orthotropic C/C-SiC Composites

next article Unique Identification of Stiffness Parameters in Hyperelastic Models for Anisotropic, Deformable, Thin Materials Based on a Single Experiment - A Feasibility Study Based on Virtual Full-Field Data

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Title: A Label-Free Measurement Method for Plane Stress States in Optical Isotropic Films with Spectroscopic Ellipsometry
Authors: X. Sun
S. Wang
W. Xing
X. Cheng
L. Li
C. Li
Z. Wang
Publication date: 24-01-2024
Publisher: Springer US
Published in: Experimental Mechanics / Issue 3/2024
Print ISSN: 0014-4851
Electronic ISSN: 1741-2765
DOI: https://doi.org/10.1007/s11340-023-01026-w

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Abstract

Background

Objective

Methods

Results

Conclusion

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