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Published in: The International Journal of Advanced Manufacturing Technology 11-12/2020

07-11-2020 | ORIGINA ARTICLE

A nanotwin-based analytical model to predict dynamics in cryogenic orthogonal machining copper

Authors: Yao Liu, Songlin Cai, Yan Chen, Mingyao Su, Lanhong Dai

Published in: The International Journal of Advanced Manufacturing Technology | Issue 11-12/2020

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Abstract

Cryogenic cooling helps to improve the machining performance and reduce the tool wear. Cryogenic condition could activate these substructures such as deformation twins and dislocation cells. The effects of the substructures are not taken into consideration in the conventional machining models. The conventional models cannot characterize the dynamics in cryogenic machining, i.e., the evolutions of cutting force and temperature with time. Here, considering the effect of the substructures, a new analytical model for metal cutting was proposed to predict the dynamics in cryogenic orthogonal machining. To validate the applicability of the proposed model, the experiments of orthogonal cutting copper at liquid nitrogen temperature and room temperature were conducted. Transmission electron microscope observations show that nanotwins formed in cryogenic cutting copper. The comparisons between experimental cutting forces and the proposed model or the conventional models validate the rationality of the nanotwin-based analytical model. Numerical calculations were further carried out to reveal the underlying mechanism. The periodic oscillation of cutting force in liquid nitrogen condition is a phenomenon of Hopf bifurcation resulting from the formation of nanotwins.

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Appendix
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Metadata
Title
A nanotwin-based analytical model to predict dynamics in cryogenic orthogonal machining copper
Authors
Yao Liu
Songlin Cai
Yan Chen
Mingyao Su
Lanhong Dai
Publication date
07-11-2020
Publisher
Springer London
Published in
The International Journal of Advanced Manufacturing Technology / Issue 11-12/2020
Print ISSN: 0268-3768
Electronic ISSN: 1433-3015
DOI
https://doi.org/10.1007/s00170-020-06303-9

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