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Science China Technological Sciences
Published in: Science China Technological Sciences 5/2022

24-02-2022 | Article

A novel approach for flip chip inspection based on improved SDELM and vibration signals

Authors: Lei Su, SiYu Zhang, Yong Ji, Gang Wang, XueFei Ming, JieFei Gu, Ke Li, Michael Pecht

Published in: Science China Technological Sciences | Issue 5/2022

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Metadata
Title
A novel approach for flip chip inspection based on improved SDELM and vibration signals
Authors
Lei Su
SiYu Zhang
Yong Ji
Gang Wang
XueFei Ming
JieFei Gu
Ke Li
Michael Pecht
Publication date
24-02-2022
Publisher
Science China Press
Published in
Science China Technological Sciences / Issue 5/2022
Print ISSN: 1674-7321
Electronic ISSN: 1869-1900
DOI
https://doi.org/10.1007/s11431-021-1964-0

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