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2022 | OriginalPaper | Chapter

A Parametric CFD Study on the Cooling Capability of a Rectangular Channel Heat Sink

Authors : Akhilesh Danesh Jatti, Mayur Chetan Shanbhag, D. S. Shashwath, Babu Rao Ponangi, V. Krishna

Published in: Recent Advances in Hybrid and Electric Automotive Technologies

Publisher: Springer Nature Singapore

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Abstract

This paper is focused on the study to determine an effective method for the thermal management and cooling of power electronic packages used in Hybrid Electric Vehicles (HEVs). It has been carried out with the help of Computational Fluid Dynamics (CFD). After extensive study, one such method chosen for the cooling application is the use of fluid-cooled heat sinks. Modeling and simulation have been carried out using COMSOL Multiphysics. Validation of the CFD results from the research paper by Quadir et al. was performed. Building upon the validation, a simple rectangular channeled heat sink was built for analysis. Furthermore, a parametric analysis was carried out by varying the channel height and channel width of the heat sink to study their effects on cooling. It was determined that an increase in the height and width together leads to a decrease in the outlet temperature and also a decrease in heat transfer coefficient.

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Literature
1.
go back to reference Khan AA, Kim KY (2016) Evaluation of various channel shapes of a microchannel heat sink. Int J Air-Condition Refrigeration 24(03):1650018CrossRef Khan AA, Kim KY (2016) Evaluation of various channel shapes of a microchannel heat sink. Int J Air-Condition Refrigeration 24(03):1650018CrossRef
2.
go back to reference Quadir G, Mydin A, Seetharamu K (2001) Analysis of microchannel heat exchangers using FEM. Int J Numerical Methods Heat Fluid Flow Quadir G, Mydin A, Seetharamu K (2001) Analysis of microchannel heat exchangers using FEM. Int J Numerical Methods Heat Fluid Flow
4.
go back to reference Turek, L.J., Rini, D.P., Saarloos, B.A., Chow, L.C.: Evaporative spray cooling of power electronics using high temperature coolant. In: 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. pp. 346–351. IEEE (2008) Turek, L.J., Rini, D.P., Saarloos, B.A., Chow, L.C.: Evaporative spray cooling of power electronics using high temperature coolant. In: 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. pp. 346–351. IEEE (2008)
Metadata
Title
A Parametric CFD Study on the Cooling Capability of a Rectangular Channel Heat Sink
Authors
Akhilesh Danesh Jatti
Mayur Chetan Shanbhag
D. S. Shashwath
Babu Rao Ponangi
V. Krishna
Copyright Year
2022
Publisher
Springer Nature Singapore
DOI
https://doi.org/10.1007/978-981-19-2091-2_22

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