1989 | OriginalPaper | Chapter
A WSI Image Processor
Author : R. M. Lea
Published in: Wafer Scale Integration
Publisher: Springer US
Included in: Professional Book Archive
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Recent advances in VLSI parallel-processing chip architecture have now provided the enabling technology for the production of real-time, low to medium resolution image processing modules. Indeed, a number of VLSI chips, incorporating from 8 to 72 processing elements on a single Silicon die, are currently in development for the construction of SIMD image processing arrays. However, such image processing modules remain large and expensive, attracting a limited and mainly military market. Nevertheless, it is widely believed that a particularly lucrative market exists, especially in the fields of high speed graphics and industrial robotics, for smaller and lower cost real-time image processing modules.