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Journal of Materials Science: Materials in Electronics

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29-04-2022

An accessible strategy for high-performance copper layer fabrication on polyphenylene oxide substrates via polydopamine functionalization and electroless deposition

Authors: Hui-gen Liu, Zhe-sheng Feng, Kang Wang, Ji-qing Lian, Yuan-ming Chen, Meng-yao Yang, Yan Wang

Published in: Journal of Materials Science: Materials in Electronics | Issue 16/2022

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Abstract

A facile and effective approach to fabricate a high-performance copper layer on polyphenylene oxide (PPO) substrate via electroless deposition for applications in the high-frequency circuit board is introduced in this study. Initially, a polydopamine coating was successfully formed on the surface of the PPO substrate after a micro-chemical etching by the combination of KMnO₄ and KOH. Due to the high hydrophilic and strong adhesion of dopamine, the silver ions were uniformly adsorbed on the PPO substrate as a catalyst of electroless copper plating. Consequently, a metal copper layer with high reliability and strong adhesion is formed, which is characterized by optical microscopy, SEM, EDS, and XRD. The resistance of the deposited copper layer was about 2.74 μΩ cm (only block 1.68 times the resistance of copper-shaped copper), and the adhesion of the copper layer also reached the 5B score in the ASTM D3559 standard after the 100-grid peel test. This technique offers a dependable method to prepare a high-performance copper layer on the PPO substrate which has a great potential to be applied in functional electronics, including industrial polymer circuits and devices.

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Title: An accessible strategy for high-performance copper layer fabrication on polyphenylene oxide substrates via polydopamine functionalization and electroless deposition
Authors: Hui-gen Liu
Zhe-sheng Feng
Kang Wang
Ji-qing Lian
Yuan-ming Chen
Meng-yao Yang
Yan Wang
Publication date: 29-04-2022
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 16/2022
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-022-08243-4

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