Analysis of Electromechanical Microdevices Using Coupled FEM-BEM Based on the TP2000 CAD Platform

We describe and demonstrate the capabilities of a new coupled-field simulator which is based on the industrial CAD platform TP2000 and especially dedicated to the multidimensional numerical analysis of the operation of electromechanical microdevices. The coupling of the finite element and the boundary element methods makes the simulation tool particularly suited for microdevices where movable parts are deflected, displaced, or rotated by electrostatic forces. As an illustrative example, we study the fully coupled electro-mechanical behaviour of a deflectable micromirror.