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Published in: Microsystem Technologies 12/2015

27-03-2015 | Technical Paper

Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration

Authors: Yi-Qi Wang, Byung-Han Ko, Sang-Geuk Jeong, Kyoung-Su Park, No-Cheol Park, Young-Pil Park

Published in: Microsystem Technologies | Issue 12/2015

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Abstract

Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.

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Metadata
Title
Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration
Authors
Yi-Qi Wang
Byung-Han Ko
Sang-Geuk Jeong
Kyoung-Su Park
No-Cheol Park
Young-Pil Park
Publication date
27-03-2015
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 12/2015
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-015-2493-8

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