Skip to main content
Top
Published in: Journal of Electronic Materials 6/2018

09-01-2018 | Topical Collection: International Conference on Thermoelectrics 2017

Assessing the Thermal Conductivity of Cu2−xSe Alloys Undergoing a Phase Transition via the Simultaneous Measurement of Thermoelectric Parameters by a Harman-Based Setup

Authors: D. Vasilevskiy, M. K. Keshavarz, J.-M. Simard, R. A. Masut, S. Turenne, G. J. Snyder

Published in: Journal of Electronic Materials | Issue 6/2018

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Metadata
Title
Assessing the Thermal Conductivity of Cu2−xSe Alloys Undergoing a Phase Transition via the Simultaneous Measurement of Thermoelectric Parameters by a Harman-Based Setup
Authors
D. Vasilevskiy
M. K. Keshavarz
J.-M. Simard
R. A. Masut
S. Turenne
G. J. Snyder
Publication date
09-01-2018
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 6/2018
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-017-6057-9

Other articles of this Issue 6/2018

Journal of Electronic Materials 6/2018 Go to the issue

Topical Collection: International Conference on Thermoelectrics 2017

Thermoelectric Properties of Cu-doped Bi0.4Sb1.6Te3 Prepared by Hot Extrusion

Topical Collection: International Conference on Thermoelectrics 2017

Preparation and Thermoelectric Properties of Graphite/Bi0.5Sb1.5Te3 Composites

Topical Collection: International Conference on Thermoelectrics 2017

Enhancement in Thermoelectric Properties of TiS2 by Sn Addition